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Παρακολουθούμενα είδη Σύνδεση
Four green DDR5 RDIMM modules without heat spreaders, 288-pin, 256GB kit

NEMIX RAM

NEMIX RAM DDR5 6400 ECC RDIMM 256GB 4x64GB CL52 1.1V 4Rx4 Supermicro X14SDW-42C-SP9F memory upgrade

SKU CH-H120-A8CKA

256 GB kit of four 64 GB DDR5 6400 ECC registered DIMMs for Supermicro X14SDW-42C-SP9F servers

  • Capacity256GB (4 x 64GB)
  • Type288-Pin DDR5 RDIMM
  • SpeedDDR5 6400 (PC5 51200)
  • CAS LatencyCL52
  • Voltage1.10V
  • ECCYes

Size 256GB 4X64GB

  • 256GB total capacity from four 64GB modules for maximum server memory density
  • DDR5-6400 speed with CL52 latency delivers rated performance on the Supermicro X14SDW-42C-SP9F
  • Registered ECC architecture corrects single-bit errors and stabilises fully populated channels
  • 1V operation matches the board's voltage spec for reliable recognition at full capacity
  • 288-pin RDIMM form factor fits the exact slot type the motherboard requires

Exact-match server memory upgrade

This 256 GB kit contains four 64 GB DDR5 RDIMMs built for the Supermicro X14SDW-42C-SP9F motherboard. Registered ECC modules with 4Rx4 organisation and CL52 timing match the board's memory controller requirements so every slot is recognised at full capacity. The 1.1 V operating voltage aligns with the platform's DDR5 specification. System integrators and IT teams can deploy the kit without manual tuning.

Thermals and power in normal operation

The modules run at the standard 1.1 V DDR5 voltage with no heat spreaders fitted. Registered buffering reduces electrical load on the memory controller when all four DIMM slots are populated. ECC circuitry corrects single-bit errors on the fly to prevent silent data corruption. Power draw scales with the 6400 MT/s data rate and full-rank population across the channels.

Build integration and constraints

The 288-pin RDIMM form factor fits only DDR5 registered DIMM slots; UDIMM or SODIMM boards will not accept these modules. Population order and maximum supported capacity per channel are defined by the Supermicro motherboard manual and must be verified before installation. The kit frees no additional slots beyond the four consumed and requires no extra cabling or cooling hardware.

Βασικά χαρακτηριστικά

  • 256GB total capacity from four 64GB modules for maximum server memory density
  • DDR5-6400 speed with CL52 latency delivers rated performance on the Supermicro X14SDW-42C-SP9F
  • Registered ECC architecture corrects single-bit errors and stabilises fully populated channels
  • 1V operation matches the board's voltage spec for reliable recognition at full capacity
  • 288-pin RDIMM form factor fits the exact slot type the motherboard requires

Προδιαγραφές

BrandNEMIX RAM
SeriesNEMIX RAM Original Series Server Memory
ModelDDR5 ECC RDIMM Registered Server Memory
Part NumberMR51200-944K4
Capacity256GB (4 x 64GB)
Type288-Pin DDR5 RDIMM
SpeedDDR5 6400 (PC5 51200)
CAS LatencyCL52
Voltage1.10V
ECCYes
Buffered/RegisteredRegistered
Rank4Rx4
ChipsetMajor OEM Samsung, Micron, Hynix
Heat SpreaderNo
Compatible SystemSupermicro
FeaturesDDR5 ECC RDIMM Motherboard Compatible
Package Content256GB 4X64GB DDR5 6400MHz PC5-51200 4Rx4 1.1V 288-PIN ECC RDIMM KIT

Άλλες εκδόσεις αυτού του μοντέλου

5 ακόμη στην ίδια σειρά

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Ερωτήσεις για αυτό το προϊόν

How do I install the four 64GB DDR5 6400 RDIMMs in the Supermicro X14SDW-42C-SP9F, and which slot order do people often get wrong?

Follow the motherboard manual's exact DIMM population sequence for the 4Rx4 registered modules; the common mistake is filling slots in numerical order instead of the board's prescribed channel interleaving pattern.

What maintenance or replacement will this 256GB DDR5 ECC RDIMM kit need over its service life?

No routine maintenance is required; the modules have no heat spreaders to clean and ECC corrects single-bit errors automatically, so replacement only occurs if a DIMM fails completely.

What limit appears first when this 4Rx4 DDR5 6400 CL52 kit runs sustained workloads on the X14SDW-42C-SP9F?

The memory controller's maximum supported rank count per channel is typically reached before thermal or bandwidth limits, capping further capacity expansion on this platform.

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