Thermal Grizzly Minus Pad 8 thermal pad 30x30mm 1.0mm

High-performance thermal pad 30×30 mm

The Thermal Grizzly Minus Pad 8 is a single thermal pad measuring 30 mm by 30 mm with a 1.0 mm thickness. It uses a ceramic silicon formula complex with nano aluminium oxide to deliver ultra-high thermal conductivity. The highly elastic and flexible material conforms to uneven surfaces on CPUs, GPUs and memory modules. Engineered in Germany, the pad is eco-friendly and RoHS-compliant.

Suits compact component cooling

This pad suits builders who need a precise 30 mm square for small dies or memory chips and want a material that conforms with only a light touch. It is not suited for larger heatspreaders that require bigger sheets, nor for users who prefer a traditional paste that can be spread to any shape. The fixed 1.0 mm thickness also limits use where a different gap fill is required.

Simple peel-and-place install

Installation is straightforward: remove the protective film, position the pad on the component and apply the cooler. The elastic surface self-aligns with minimal pressure, so no spreading tools or curing time are needed. The main risk is tearing the soft material if it is lifted and repositioned repeatedly, and ensuring the 1.0 mm thickness matches the exact gap to avoid poor contact or excessive pressure.