BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
- Rackmount
Me võtame vastu krüptoraha — nii saab teie hoitav krüptoraha osta päris riistvara.Makske krüptorahaga, kulutage seda päris riistvarale. Tasuta kindlustatud tarne kogu maailmas, üle 399 $. Lihtsad, kaubamärgita väliskarbid, saadetud Saksamaalt.Tasuta kindlustatud tarne üle 399 $. Teie kurss lukustatakse 30 minutiks kohe, kui kassa avaneb.Kurss lukustatud 30 minutiks. Iga toode on pitseeritud, selle seerianumber on kontrollitud ja sellel kehtib 24-kuuline garantii.Pitseeritud, 24-kuulise garantiiga.
ASUS
mATX board for 12, 13 and 14th Gen Intel CPUs with DDR5, PCIe 4.0, two M.2 slots, 2.5Gb Ethernet, Wi-Fi 6, rear USB 3.2 Gen 2, front USB 3.2 Gen 1 Type-C, VRM and M.2 heatsinks.
This mATX board uses the Intel B760 chipset and LGA 1700 socket. It supports 12th, 13th and 14th generation Intel processors. DDR5 memory is supported with ASUS Enhanced Memory Profile II and OptiMem II. It suits builders who need integrated Wi-Fi 6 and 2.5Gb Ethernet in a compact form factor.
Comprehensive cooling includes VRM heatsinks, an M.2 heatsink and a PCH heatsink. Hybrid fan headers connect to Fan Xpert 2+ software for automatic curve control. The power delivery uses solid chokes and durable capacitors for stable voltage under load. Noise stays low during typical desktop workloads.
Two M.2 slots operate at PCIe 4.0 speeds for fast storage expansion. Both slots include dedicated heatsinks to maintain performance. Builders who need more than two M.2 drives must add a PCIe adapter card. The board provides four SATA 6 Gbps ports for additional drives.
| CPU Socket Type | LGA 1700 |
|---|
Mount the board using the mATX standoff pattern, fit the LGA 1700 CPU with the load-plate lever, seat DDR5 modules until the latches click, attach the VRM and M.2 heatsink screws, then connect the 8-pin CPU power and 24-pin ATX cables — builders often forget the 8-pin CPU power.
Clean dust from the VRM heatsinks, M.2 heatsink and PCH heatsink every few months; verify Fan Xpert 2+ curves still spin the hybrid fan headers; the CMOS battery will eventually need swapping to keep BIOS settings.
The VRM heatsink thermal capacity is the first bottleneck under continuous all-core workloads, so case airflow and Fan Xpert 2+ tuning become critical before any PCIe 4.0 or DDR5 ceiling is reached.
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