BFKK
BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
- Rackmount
214,99 $
0.00278322BTC
Laos
Corsair
Corsair Vengeance LPX CMK16GX4M2E3200C16W 16GB DDR4 desktop RAM
A 16 GB DDR4 desktop kit with two 8 GB modules running at 3200 MT/s CL16, a low 34 mm profile and anodized aluminium heat spreaders for broad Intel and AMD motherboard compatibility
- Capacity16GB (2 x 8GB)
- Type288-Pin PC RAM
- SpeedDDR4 3200 (PC4 25600)
- CAS LatencyCL16
- Timing16-20-20-38
- Voltage1.35V
- 16 GB dual-channel kit speeds up multitasking with 3200 MT/s DDR4
- CL16 16-20-20-38 timing keeps latency low for responsive applications
- 35 V operation reduces power draw and heat output
- 34 mm low-profile height fits tight small-form-factor builds
- Intel XMP 2.0 profile enables one-click setup on supported motherboards
16 GB dual-channel DDR4 kit
This Corsair Vengeance LPX kit delivers 16 GB across two 8 GB modules for desktop systems. White anodized aluminum heatspreaders keep the modules cool while matching light-themed builds. Hand-sorted chips provide headroom for enthusiasts who want to push frequencies beyond stock settings. The unbuffered design suits standard consumer motherboards.
3200 MT/s with CL16 timing
Rated at DDR4 3200 (PC4 25600) with a CAS latency of 16 and timings of 16-20-20-38, this kit runs at 1.35 V. The single decisive figure is the 3200 MT/s data rate paired with CL16; if your platform cannot reach that speed or requires tighter latency, this module will not meet the target. Intel XMP 2.0 support applies the profile with one BIOS selection.
34 mm low-profile height
At just 34 mm tall, the modules clear most oversized CPU coolers and fit small-form-factor cases without interference. The solid aluminum heatspreader and high-performance PCB work together to maintain signal integrity during extended high-speed operation. No extra software or cables are bundled; the XMP profile is the only setup aid included.
Põhijooned
- 16 GB dual-channel kit speeds up multitasking with 3200 MT/s DDR4
- CL16 16-20-20-38 timing keeps latency low for responsive applications
- 35 V operation reduces power draw and heat output
- 34 mm low-profile height fits tight small-form-factor builds
- Intel XMP 2.0 profile enables one-click setup on supported motherboards
Tehnilised andmed
| Brand | CORSAIR |
|---|---|
| Series | Vengeance LPX |
| Model | CMK16GX4M2E3200C16W |
| Capacity | 16GB (2 x 8GB) |
| Type | 288-Pin PC RAM |
| Speed | DDR4 3200 (PC4 25600) |
| CAS Latency | CL16 |
| Timing | 16-20-20-38 |
| Voltage | 1.35V |
| ECC | No |
| Buffered/Registered | Unbuffered |
| BIOS/Performance Profile | Intel XMP 2.0 |
| Color | White |
| Heat Spreader | Anodized Aluminum |
| Features | Hand-sorted memory chips ensure high performance with generous overclocking headroom. VENGEANCE LPX is optimized for wide compatibility with the latest Intel and AMD DDR4 motherboards. A low-profile height of just 34mm ensures that VENGEANCE LPX even fits in most small-form-factor builds. A high-performance PCB guarantees strong signal quality and stability for superior overclocking ability. A solid aluminum heatspreader efficiently dissipates heat from each module so that they consistently run at high clock speeds. Supports Intel XMP 2.0 for simple one-setting installation and setup |
| Recommend Use | AMD 400 Series / AMD 500 Series / Intel 300 Series / Intel 400 Series / Intel 500 Series |
| Tarnekaal | 0.10 kg |
| Pakendi mõõtmed | 152 × 89 × 10 mm |
Küsimused selle toote kohta
What does the DDR4 3200 speed mean once the kit is installed in a real machine?
The kit runs at DDR4 3200 with CL16 timings at 1.35V when the Intel XMP 2.0 profile is enabled in the BIOS; without XMP it will operate at the motherboard's default DDR4 speed.
What interface does the kit use and what does it limit in practice?
The 288-pin DDR4 interface limits the kit to DDR4 motherboards and caps the maximum data rate at DDR4 3200 (PC4 25600).
What physical space does the 34mm module height require for fitting or mounting?
The low-profile 34mm height clears most CPU coolers and fits in small-form-factor cases that cannot accommodate taller memory modules.
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