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Two green DDR4 SO-DIMM sticks with black chips, 260-pin form factor

SAMSUNG

SAMSUNG M471A1K43DB1-CWE 16GB DDR4-3200 laptop RAM

SKU CH-742G-0J6RD

16 GB dual-channel DDR4-3200 SODIMM kit with CL22 latency and 1.2 V operation

  • Capacity16GB (2 x 8GB)
  • Type260-Pin DDR4 SO-DIMM
  • SpeedDDR4 3200 (PC4 25600)
  • CAS LatencyCL22
  • Voltage1.20V
  • ECCNo
  • 16 GB kit speeds up multitasking with two 8 GB modules
  • DDR4 3200 MHz delivers fast data transfer rates
  • CL22 latency provides responsive memory performance
  • 2 V operation keeps power draw low
  • 260-pin SODIMM fits standard laptop slots

16 GB DDR4-3200 laptop kit

This Samsung kit provides 16 GB of DDR4 memory across two 8 GB SODIMM modules rated at 3200 MT/s. It targets users upgrading compatible notebooks that accept 260-pin unbuffered non-ECC memory. The single-rank x8 organisation helps compatibility with a wide range of DDR4 laptop platforms.

Standard voltage and latency

Modules operate at the standard 1.20 V with a CAS latency of CL22. Power draw stays within normal DDR4 SODIMM limits for typical laptop workloads. Passive cooling is used, so the kit adds no fan noise and relies on the notebook’s existing thermal solution.

Two-module convenience

The matched pair enables dual-channel operation on supported systems without the buyer sourcing separate sticks. No software, heat spreaders or additional accessories are included beyond the two modules themselves.

Põhijooned

  • 16 GB kit speeds up multitasking with two 8 GB modules
  • DDR4 3200 MHz delivers fast data transfer rates
  • CL22 latency provides responsive memory performance
  • 2 V operation keeps power draw low
  • 260-pin SODIMM fits standard laptop slots

Tehnilised andmed

BrandSAMSUNG
ModelM471A1K43DB1-CWE
Capacity16GB (2 x 8GB)
Type260-Pin DDR4 SO-DIMM
SpeedDDR4 3200 (PC4 25600)
CAS LatencyCL22
Voltage1.20V
ECCNo
Buffered/RegisteredUnbuffered / Unregistered

Küsimused selle toote kohta

How do I install the 260-pin DDR4 SO-DIMM modules in my laptop?

Power off the laptop, remove the battery if possible, open the memory compartment, align the notch on each module with the slot key, insert at an angle then press down until the retention clips click into place.

Will the single-rank x8 modules need any firmware updates or replacement over time?

No firmware updates are required for standard JEDEC DDR4 modules; they are solid-state with no moving parts and do not wear out under normal use, so replacement is only needed if a fault develops.

At what point does the CL22 latency become the bottleneck during sustained workloads?

CAS latency 22 sets the minimum timing for each memory access; under continuous heavy loads the processor waits for each column strobe, making latency the first limiting factor before bandwidth saturates.

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