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Black low-profile CPU cooler with 60mm fan and copper heat pipes visible through aluminum fins

Silverstone

Silverstone SST-AR09-115XP 60mm 2 Ball CPU Cooler

SKU CH-9ZSR-3KX8A MPN SST-AR09-115XP

A low-profile 60 mm dual ball-bearing cooler with three 6 mm heat-pipes fits Intel LGA 1150, 1151, 1155 and 1156 sockets in 66 mm of height

  • ColorBlack
  • TypeFan & Heatsinks
  • Fan Size60mm
  • CPU Socket CompatibilityIntel LGA 1150 / Intel LGA 1151 / Intel LGA 1155 / Intel LGA
  • Bearing Type2 Ball
  • RPM1200 - 5000 RPM

Model AR09-115XP

  • Low-profile 66 mm height fits tight chassis
  • Three 6 mm copper heat-pipes with HDC transfer heat directly from the CPU
  • Dual ball-bearing PWM fan spins 1200 to 5000 RPM for scalable airflow
  • Push-pin mounting secures the cooler on Intel LGA 1150, 1151, 1155 and 1156 sockets
  • 02 to 42.5 dBA noise range lets you balance cooling and quiet operation

Argon Series 60mm Cooler

The Silverstone SST-AR09-115XP is a low-profile air cooler built for Intel LGA 1150, 1151, 1155 and 1156 sockets. Its 66mm height suits compact chassis where taller towers cannot fit. Three 6mm copper heat-pipes use direct-contact technology to move heat into aluminum fins. A 60mm dual ball-bearing PWM fan spins between 1200 and 5000 RPM.

66mm Height Clearance

The cooler measures 66mm tall with the fan installed, making overall height the single specification that decides fitment. Builders must confirm their case allows at least this much space above the CPU socket. The push-pin mounting system secures the unit without a back-plate, simplifying installation in tight layouts. Heatsink dimensions are 93mm by 66mm by 93mm including the fan.

Dual Ball-Bearing PWM Fan

The bundled 60mm fan runs on a 2-ball bearing for durability at speeds up to 5000 RPM. PWM control lets the motherboard adjust speed automatically, balancing airflow from 6.7 to 27.9 CFM against noise from 18.02 to 42.5 dBA. No extra brackets, thermal paste tubes or software utilities are included in the package.

Erősségek

  • Low-profile 66 mm height fits tight chassis
  • Three 6 mm copper heat-pipes with HDC transfer heat directly from the CPU
  • Dual ball-bearing PWM fan spins 1200 to 5000 RPM for scalable airflow
  • Push-pin mounting secures the cooler on Intel LGA 1150, 1151, 1155 and 1156 sockets
  • 02 to 42.5 dBA noise range lets you balance cooling and quiet operation

Műszaki adatok

BrandSILVERSTONE
SeriesArgon Series
ModelSST-AR09-115XP
ColorBlack
TypeFan & Heatsinks
Fan Size60mm
CPU Socket CompatibilityIntel LGA 1150 / Intel LGA 1151 / Intel LGA 1155 / Intel LGA 1156
Bearing Type2 Ball
RPM1200 - 5000 RPM
Air Flow6.7 - 27.9 CFM
Noise Level18.02 - 42.5 dBA
Heatsink MaterialCopper heat pipes with aluminum fins
Max CPU Cooler Height66 mm
Fan Dimensions60.00mm x 60.00mm x 25.00mm
Heatsink Dimensions93.00m x 66.00mm x 93.00mm (w/ Fan)
Weight0.47 lbs. w/o fan
FeaturesThree 6mm heat-pipes and aluminum fins for excellent heat conducting efficiency
Heat-pipe direct contact (HDC) technology
60mm dual ball bearing PWM fan
Push-Pin design for convenient installation
Intel LGA1150/1151/1155/1156 compatible
Szállítási súly0.36 kg
Csomagméret117 × 112 × 109 mm

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Kérdések a termékről

What does the 6.7-27.9 CFM range mean for cooling an Intel LGA 1150/1151/1155/1156 CPU in a real build?

The PWM fan spins from 1200 to 5000 RPM to push 6.7-27.9 CFM across the aluminum fins, giving enough airflow for typical LGA 115x thermal loads while staying between 18.02 and 42.5 dBA.

How does the 60 mm PWM fan and push-pin mounting work with the Intel LGA 1150/1151/1155/1156 socket interface?

The 60 mm dual ball-bearing PWM fan connects to a standard 4-pin CPU header for speed control, and the push-pin brackets lock directly onto the LGA 115x retention holes without a backplate.

Will the 66 mm tall, 93 mm square cooler fit my case and motherboard layout?

Total height is 66 mm with the 25 mm thick fan attached; the heatsink footprint is 93 mm x 93 mm, so verify at least 66 mm CPU-cooler clearance and no tall RAM or VRM heatsinks within that square.

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