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White aluminium heat-spreader DDR4 desktop memory module

Timetec

Timetec Pinnacle Konduit 8GB DDR4 3200MHz White

SKU CH-MJQ2-RJZE2

An 8 GB DDR4 module running at 3200 MHz with a white aluminium heat spreader and CL16 timings

  • Capacity8GB
  • SpeedDDR4 3200 (PC4 25600)
  • ColorWhite

Capacity 8GB

  • White aluminium heat spreader keeps temperatures low
  • 8 GB single module gives 3200 MHz DDR4 speed
  • CL16-18-18-38 timings deliver low latency response
  • XMP 2.0 support enables one-click overclocking in BIOS
  • Compatible with AMD and Intel DDR4 motherboards

Pinnacle Konduit DDR4 Module

The Timetec Pinnacle Konduit is an 8GB DDR4 desktop memory module rated at 3200MHz with CL16-18-18-38 timings. It uses a single-rank 1Rx8 layout and runs at 1.35V. The white aluminium heat spreader covers the PCB. It targets gamers and PC enthusiasts who want a straightforward upgrade for an AMD or Intel platform.

Thermals and Power at Stock

The aluminium heat spreader and a high-conductivity thermal pad move heat away from the memory ICs during normal operation. At the default 2400MHz JEDEC speed the module draws 1.35V, keeping power consumption modest. No active cooling is required, so the kit adds no audible noise to the build.

Sustained Load Behaviour

Enabling XMP 2.0 in the BIOS lifts the speed to 3200MHz with the rated CL16-18-18-38 timings. The reinforced heatsink is designed to maintain stable temperatures during extended gaming or rendering sessions. Each IC is individually screened to support the higher data rate without throttling.

Privalumai

  • White aluminium heat spreader keeps temperatures low
  • 8 GB single module gives 3200 MHz DDR4 speed
  • CL16-18-18-38 timings deliver low latency response
  • XMP 2.0 support enables one-click overclocking in BIOS
  • Compatible with AMD and Intel DDR4 motherboards

Specifikacijos

Capacity8GB
SpeedDDR4 3200 (PC4 25600)
ColorWhite

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How do I install the 288-pin DDR4 module and enable the XMP 2.0 profile to reach 3200 MHz instead of the 2400 MHz default?

Align the notch on the module with the slot key, press firmly until the retention clips click, then enter the BIOS and activate the XMP 2.0 setting so the memory runs at its rated 3200 MHz speed.

What maintenance will the white aluminum heat spreader and thermal pad require over time?

Periodically remove dust from the heat spreader fins with compressed air; the thermal pad is a passive component and does not need replacement under normal use.

At what CAS latency does the module run when the XMP 2.0 profile is active at 3200 MHz?

The tested latency at 3200 MHz is CL16-18-18-38 when XMP 2.0 is enabled in the BIOS.

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