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Silver 4U rackmount server chassis, front eight hot-swap drive bays, dual redundant power supplies at rear

ASUS

ASUS ESC8000-E11-3W10G 4U barebone server dual Xeon 32 DDR5 8 NVMe 11 PCIe 5.0 3000W

SKU CH-2W8Z-9RT35 MPN ESC8000-E11-3W10G

4U dual-socket barebone supporting eight dual-slot GPUs, 32 DDR5 ECC slots, 11 PCIe 5.0 slots and eight hot-swap Tri-Mode NVMe bays with redundant 3000W Titanium power

  • Form Factor4U Rackmount
  • CPU TypeIntel Xeon Processor Scalable Family (Up to 350W)
  • Installed CPUNo CPU Installed
  • Max Processors2
  • Memory Slots32 x 288Pin
  • Installed Memory SizeNo Memory Installed
  • Dual 5th Gen Xeon sockets deliver 21% more performance per watt for AI workloads
  • 32 DDR5 ECC RDIMM slots support up to 4 TB for large model training
  • 8 hot-swap Tri-Mode NVMe/SATA/SAS bays provide scale-up all-flash storage
  • 11 PCIe 5.0 slots plus OCP 3.0 enable future-proof I/O expansion
  • 2+2 redundant 3000 W Titanium PSUs ensure mission-critical uptime

Dual-socket AI server barebone

The ASUS ESC8000-E11-3W10G is a 4U rackmount barebone built for dual Intel Xeon Scalable processors and up to eight dual-slot GPUs. It targets organisations deploying large-scale AI training, HPC simulations or inference workloads that demand dense accelerator support and high memory bandwidth.

From single-socket or PCIe 4.0 platforms

Moving to this chassis is worthwhile when workloads outgrow a single CPU socket or require the bandwidth of 11 PCIe 5.0 slots plus an OCP 3.0 module. The jump makes sense for teams scaling multi-GPU clusters, adding NVLink bridges or adopting DPU offload where previous generation I/O becomes the bottleneck.

Verify CPU cooler clearance and GPU power budget

Confirm that chosen Xeon coolers fit the 4U airflow tunnels and that the combined GPU power draw stays within the 2+2 redundant 3000W Titanium supply limits. Ensure DDR5 4800/4400 RDIMM or 3DS RDIMM modules are sourced in multiples of two per channel and that front Tri-Mode bays match the NVMe, SATA or SAS drives you plan to install.

Priekšrocības

  • Dual 5th Gen Xeon sockets deliver 21% more performance per watt for AI workloads
  • 32 DDR5 ECC RDIMM slots support up to 4 TB for large model training
  • 8 hot-swap Tri-Mode NVMe/SATA/SAS bays provide scale-up all-flash storage
  • 11 PCIe 5.0 slots plus OCP 3.0 enable future-proof I/O expansion
  • 2+2 redundant 3000 W Titanium PSUs ensure mission-critical uptime

Specifikācijas

BrandASUS
ModelESC8000-E11-3W10G
Form Factor4U Rackmount
CPU TypeIntel Xeon Processor Scalable Family (Up to 350W)
Installed CPUNo CPU Installed
Max Processors2
Memory Slots32 x 288Pin
Installed Memory SizeNo Memory Installed
Max Memory SupportedMaximum up to 3TB per CPU socket
Memory Type SupportedDDR5 4800/4400 RDIMM/ 3DS RDIMM (2DIMM per Channel)
Installed HDDNo Storage Installed
Serial ATA8 x NVMe/SATA/SAS
M.21 x M.2 Socket, supports up to 22110 type (PCIe Gen3 x4 link)
First LANIntel I710-AT2
Max. LAN Speed10 Gigabit
3.5" Bays8
Front USB2 x USB 3.2 Gen1
COM1
VGA1 x VGA (Rear)
Rear USB2 x USB 3.2 Gen1
RJ452 x 10GbE LAN ports (RJ45)
Other Ports1 x Management port (RJ45)
Max. Power3000W Redundant 2+2 Platinum
TemperatureOperation temperature: 10°C ~ 35°C
Non operation temperature: -40°C ~ 70°C
HumidityNon operation humidity: 20% ~ 90% ( Non condensing)
Dimensions31.50" x 17.32" x 6.87"
Weight59.52 lbs.
Sūtījuma svars52.16 kg
Sūtījuma izmēri1113 × 595 × 395 mm

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