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coxbyte

coxbyte TG-25 Thermal Paste 13.8 W/mK 2g

SKU CH-V7BV-ZEJ3B

High-conductivity thermal paste rated at 13.8 W/mK, non-conductive and stable from -50 °C to 250 °C, supplied in a 2 g syringe

  • Volume / Net Weight2g
  • Thermal Conductivity13.8 W/mK
  • Long Term Operating Temperature-50 to 250 C
  • SpecificationsTG-25adopts an improved nanocarbon tube composite formula wi
  • High thermal conductivity of 13.8 W/mK rapidly moves heat from CPU and GPU cores
  • Reduces core temperature difference by over 20°C for stable gaming and overclocking
  • Non-conductive silicone formula eliminates short-circuit risk on exposed components
  • Operates from -50°C to 250°C without volatilisation for long-term reliability
  • Less than 3% performance degradation over five years extends service life

High-Conductivity Thermal Paste for CPU and GPU

Coxbyte TG-25 thermal compound delivers 13.8 W/mK conductivity in a 2 g syringe. The non-conductive silicone formula eliminates short-circuit risks while filling microscopic gaps between dies and coolers. Stable from -50 °C to 250 °C, it resists volatilisation and degrades less than 3 % over five years. Designed for desktop PCs, gaming laptops, graphics cards and LED modules.

Ideal for enthusiasts chasing lower core

Overclockers and esports players benefit from the high conductivity rating and long-term stability. Builders working in compact ITX cases appreciate the paste's compatibility with dense component layouts. Users needing only a single small application for routine maintenance may find the 2 g volume more than required. Buyers expecting a metal-based liquid-metal alternative should look elsewhere.

Verify cooler mounting pressure

Clean both die and cold-plate thoroughly to remove old compound residue. Apply a thin layer roughly the thickness of an A4 sheet at the centre of the CPU or GPU. Ensure the heatsink seats evenly to spread the paste without air pockets. Confirm your cooler's retention mechanism provides sufficient clamping force for optimal thermal transfer.

Priekšrocības

  • High thermal conductivity of 13.8 W/mK rapidly moves heat from CPU and GPU cores
  • Reduces core temperature difference by over 20°C for stable gaming and overclocking
  • Non-conductive silicone formula eliminates short-circuit risk on exposed components
  • Operates from -50°C to 250°C without volatilisation for long-term reliability
  • Less than 3% performance degradation over five years extends service life

Specifikācijas

Brandcoxbyte
SeriesTG
Model25
Volume / Net Weight2g
Thermal Conductivity13.8 W/mK
Long Term Operating Temperature-50 to 250 C
SpecificationsTG-25adopts an improved nanocarbon tube composite formula with a thermal conductivity of 13.8W/mK (measured value), which can quickly reduce the temperature difference between CPU/GPU cores and meet the cooling needs of mainstream gaming consoles, high-performance graphics cards, and workstations. Its non-conductive properties completely avoid the risk of short circuit, with good viscosity optimization. Single point or nine point coating can be extended to a uniform thermal conductive layer with a thickness of 0.15mm, improving operational convenience by 15%. After curing, the temper

Jautājumi par šo preci

Do I need a scraper or similar tool to spread the 2 g of TG-25 paste evenly?

Yes, the instructions call for a scraper or other tool to spread the paste to roughly the thickness of an A4 sheet after placing a central dab on the CPU or GPU.

Will the non-conductive formula of this 13.8 W/mK compound remain safe if it contacts exposed components on an older motherboard?

The paste is electrically non-conductive, so accidental contact with nearby resistors or traces will not create a short-circuit risk.

How can I verify the paste is performing correctly once the system is running?

Monitor CPU or GPU core temperatures under load; a properly applied layer should lower the core-to-cooler temperature difference by over 20 °C.

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