BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
- Rackmount
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G.SKILL
A 64 GB dual-channel DDR5 kit running at 6000 MT/s with CL36 timings, 1.35 V operation, 33 mm low-profile heat spreaders, and AMD EXPO plus Intel XMP 3.0 support for Ryzen 7000/8000/9000
The G.SKILL Flare X5 kit provides 64GB of DDR5 memory across two 32GB modules rated at 6000 MT/s with CL36 timings. It runs at 1.35V and carries both AMD EXPO and Intel XMP 3.0 profiles for one-click configuration. A white low-profile heatspreader keeps the modules at 33mm height for tight cooler clearance.
This dual-channel kit targets current AMD 600/800 series and Intel 700/800 series platforms that support DDR5 6000. Systems limited to lower memory speeds or lacking EXPO/XMP 3.0 support will not reach the rated frequency and timings. The unbuffered non-ECC design is intended for consumer desktop workloads.
At 33mm tall the modules clear most large air coolers and liquid-cooler brackets that block standard-height DIMMs. If your build uses a compact case or a tower cooler with tight DIMM clearance this height is the critical dimension to verify before purchase.
| Brand | G.SKILL |
|---|---|
| Series | Flare X5 |
| Model | F5-6000J3636F32GX2-FX5W |
| Capacity | 64GB (2 x 32GB) |
| Type | 288-Pin PC RAM |
| Speed | DDR5 6000 (PC5 48000) |
| CAS Latency | CL36 |
| Timing | 36-36-36-96 |
| Voltage | 1.35V |
| ECC | No |
| Buffered/Registered | Unbuffered / Unregistered |
| Multi-channel Kit | Dual Channel Kit |
| BIOS/Performance Profile | AMD EXPO / Intel XMP 3.0 / Intel XMP 3.0 and AMD EXPO |
| Color | White |
| Heat Spreader | Yes |
| Features | Flare X5 series is a low-profile DDR5 memory designed for high performance on compatible DDR5-enabled AMD platforms, and supports AMD EXPO overclocking profiles to enable easy memory overclocking by simply enabling the EXPO profile in the BIOS with a compatible motherboard and processor. Featuring a 33mm low-profile height and built with hand-screened IC chips, the Flare X5 is an excellent choice for compact performance PC builds. • Optimized for AMD Ryzen 7000/9000 series processors or later • 33mm Low-profile module height design • Intel XMP 3.0 & AMD EXPO Support |
| Recommend Use | Intel 700/800 Series Chipset; AMD 600/800 Series Chipset 13th/14th Gen Intel® Core™ Desktop ProcessorsIntel® Core™ Ultra 200 Series Desktop ProcessorsAMD Ryzen™ 7000/8000/9000 Series Processors |
| LED Color | None |
| Sūtījuma svars | 0.23 kg |
| Sūtījuma izmēri | 165 × 140 × 3 mm |
The AMD EXPO profile on this Flare X5 kit sets DDR5 6000 with CL36-36-36-96 timings at 1.35V.
At 33 mm tall the white heat-spreader modules sit lower than most tower coolers, so clearance is rarely an issue.
Enter the BIOS, enable the AMD EXPO or Intel XMP 3.0 profile for this F5-6000J3636F32GX2-FX5W kit, save and reboot.
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