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M.2 2280 SSD with black graphene heatsink, 80 by 22 mm

HUADISK

HUADISK HYV1TBX3(XT) 1TB internal SSD

SKU CH-GGSA-R57SX

M.2 2280 internal SSD with 1 TB capacity, up to 1900 MB/s read and 1800 MB/s write, 600 TBW endurance and graphene heatsink

  • Max Sequential ReadUp to 1900 MBps
  • Max Sequential WriteUp to 1800 MBps
  • 4KB Random ReadUp to 200,000 IOPS
  • 4KB Random WriteUp to 230,000 IOPS
  • Terabytes Written (TBW)600TB
  • Form FactorM.2 2280

Capacity 1TB

  • Sequential reads up to 1900 MBps cut load times
  • Sequential writes up to 1800 MBps speed large file saves
  • 600 TBW endurance rating supports heavy workloads
  • Graphene cooling layer lowers drive temperature by up to 10 °C
  • PCIe 3.0 x4 interface with NVMe 1.3 protocol fits M.2 2280 slots

1TB NVMe 1.3 PCIe 3.0 x4 drive

The HUADISK HYV1TBX3(XT) is a 1TB internal SSD in the M.2 2280 form factor. It uses 3D NAND flash and the NVMe 1.3 protocol over a PCIe 3.0 x4 interface. Sequential reads reach 1900 MBps and writes reach 1800 MBps. Random 4KB performance hits 200,000 read IOPS and 230,000 write IOPS.

Suits PCs and laptops needing a 1TB NVMe upgrade

This drive fits desktops and notebooks with an M.2 2280 slot that supports PCIe 3.0 x4 and NVMe 1.3. It works with Windows 8, 10, 11 and Linux; Windows 7 requires extra drivers. The 600 TBW rating covers heavy consumer workloads. Systems without an M.2 PCIe slot cannot use it.

Graphene heatsink keeps temps steady under load

A graphene layer reduces drive temperature by roughly 10°C during sustained transfers, 4K editing or gaming sessions. Active power draw is 3.23W and idle drops to 1.19W. The operating range spans 0°C to 70°C, so performance stays consistent inside a warm chassis. SMART monitoring and TRIM maintain long-term health.

Priekšrocības

  • Sequential reads up to 1900 MBps cut load times
  • Sequential writes up to 1800 MBps speed large file saves
  • 600 TBW endurance rating supports heavy workloads
  • Graphene cooling layer lowers drive temperature by up to 10 °C
  • PCIe 3.0 x4 interface with NVMe 1.3 protocol fits M.2 2280 slots

Specifikācijas

Max Sequential ReadUp to 1900 MBps
Max Sequential WriteUp to 1800 MBps
4KB Random ReadUp to 200,000 IOPS
4KB Random WriteUp to 230,000 IOPS
Terabytes Written (TBW)600TB
Form FactorM.2 2280
Capacity1TB
InterfacePCI-Express 3.0 x4
Memory Components3D NAND
ProtocolNVMe 1.3
Power Consumption (Active)3.23W
Power Consumption (Idle)1.19W
Operating Temperature0°C ~ +70°C
Storage Temperature-20°C ~ +75°C
Operating Humidity5-95%
BrandHUADISK
SeriesHYVXXXX3(XT)
ModelHYV1TBX3(XT)
Device TypeInternal Solid State Drive (SSD)
Used ForConsumer
Height22mm
Width80mm
Depth2.1mm
Weight40g

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Jautājumi par šo preci

Does my motherboard need a PCI-Express 3.0 x4 M.2 2280 slot for this drive to work?

Yes, the drive uses the PCI-Express 3.0 x4 interface in the M.2 2280 form factor, so the motherboard must provide that exact slot type.

Will the graphene heatsink on this 1TB drive fit inside my existing laptop chassis?

The drive measures 80mm long, 22mm wide and 2.1mm thick, so it fits standard M.2 2280 bays; the graphene layer does not add measurable height beyond that profile.

How can I verify the drive is delivering its rated 1900 MBps read speed after installation?

Run a sequential-read benchmark such as CrystalDiskMark; a result near 1900 MBps confirms the NVMe 1.3 controller and 3D NAND are performing to spec.

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