minisforum MF-X1Pro-370(32+0)US barebone mini PC Ryzen AI 9 HX 370 32GB DDR5 no SSD
- Silver
- AI Ready
Mēs pieņemam kriptovalūtu — lai tā, kas Jums pieder, varētu nopirkt īstu aparatūru.Maksājiet kriptovalūtā, iztērējiet to īstai aparatūrai. Bezmaksas apdrošināta piegāde visā pasaulē virs 399 $. Vienkāršas, nemarķētas kastes, sūtītas no Vācijas.Bezmaksas apdrošināta piegāde virs 399 $. Jūsu kurss tiek fiksēts uz 30 minūtēm, tiklīdz atveras kase.Kurss fiksēts uz 30 minūtēm. Katra prece ir aizzīmogota, tās sērijas numurs ir pārbaudīts, un uz to attiecas 24 mēnešu garantija.Aizzīmogots, 24 mēnešu garantija.
minisforum
Barebone mini PC with 12-core Ryzen AI 9 HX 470, 86 TOPS AI performance, Radeon 890M graphics, DDR5-5600 support to 128 GB, three M.2 slots, dual 2.5 GbE, Wi-Fi 7 and quad 8K display output
CPU Type AMD Ryzen AI 9 HX 470
Memory Type 0GB
SSD Type 0GB
The minisforum MF-X1Pro-470 is a barebone mini PC built around the AMD Ryzen AI 9 HX 470 processor. It delivers twelve Zen 5 cores with twenty-four threads and a maximum boost of 5.2 GHz. The system provides up to 86 TOPS of overall compute performance and 55 TOPS from the integrated NPU for local AI workloads. Integrated AMD Radeon 890M graphics based on RDNA 3.5 architecture handle visual output. The silver chassis includes a dedicated Copilot button for quick access to Microsoft Copilot.
This unit replaces entry-level mini PCs that rely on single gigabit Ethernet and Wi-Fi 6. The jump is justified when you need dual 2.5 Gbps LAN ports, Wi-Fi 7 with up to 30 Gbps throughput and Bluetooth 5.4. Display connectivity steps up to HDMI 2.1, DisplayPort 2.0 and two USB4 ports running at 40 Gbps, enabling simultaneous 8K output across four screens. Memory expands to 128 GB of DDR5 5600 via two SO-DIMM slots, while storage uses three M.2 2280 slots, two wired for PCIe 4.0 x4 and one for PCIe 4.0 x1.
The barebone format suits enthusiasts and professionals who want to choose memory capacity and storage size themselves. It also fits workflows that demand quad 8K display support, high-speed wired and wireless networking and front-panel USB4 with 15 W power delivery. Buyers who need a complete system with memory and storage pre-installed should look at a ready-to-go mini PC instead. Users requiring discrete graphics performance beyond the integrated Radeon 890M will need a larger platform.
| Brand | MINISFORUM |
|---|---|
| Model | X1 Pro-470 |
| Color | Silver |
| AI Features | AI Ready |
| CPU Type | AMD Ryzen AI 9 HX 470 |
| CPU Cores | 12-Core |
| CPU Feature | 12 cores, 24 threads, max. 5.2GHz Overall TOPS: Up to 86 TOPS |
| Memory installed | No Memory |
| Memory slot | 2 x 262Pin SO-DIMM |
| Memory Type Supported | DDR5 5600 |
| Max Memory Supported | 128GB |
| Storage Installed | No Storage |
| M.2 Slot | 2 x M.2 2280 NVME SSD Slot(Up to 4TB) (PCIe4.0x4) 1 x M.2 2280 NVME SSD Slot(Up to 4TB) (PCIe4.0x1) |
| Integrated Graphics | AMD Radeon 890M |
| Max LAN Speed | Dual 2.5Gbps |
| Wireless LAN | 802.11be |
| WiFi Generation | Wi-Fi 7 |
| Bluetooth | Bluetooth 5.4 |
| Front USB | 2 x USB 3.2 Gen2 Type-A 1 x UBS4 (Alt PD Out 15W | 40Gbps) |
| Front Audio Ports | 1 x 3.5 mm combo jack |
| Card Reader | SD card slot |
| HDMI | 1 x HDMI 2.1 FRL |
| DisplayPort | 1 x DisplayPort 2.0 |
| Rear USB | 1 x USB 2.0 Type-A port 1 x USB4 (Alt PD in 65-100W & PD Out 15W | 40Gbps) |
| RJ45 | 2 |
| Other Rear Ports | 1 x OCuLink |
| Power Supply | AC Input 100-240V/ 50-60Hz, Internal DC Adapter 19V/7.1A 134.9W |
| Dimensions | 195 x 195 x 42.5mm |
| Weight | 1.36 kg |
| Packaging | 1 x X1 Pro-470 Mini PC 1 x US Power Adapter 1 x HDMI Cable 1 x Manual |
| Sūtījuma svars | 2.18 kg |
| Sūtījuma izmēri | 211 × 211 × 109 mm |
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The board accepts standard 262-pin DDR5 SO-DIMMs at 5600 MT/s, up to 128 GB total across the two slots.
Each M.2 2280 slot uses a single motherboard standoff screw; remove the bottom cover, insert the drive at an angle, then fasten the screw — the step often missed is seating the drive fully before tightening.
Replace pads if they become compressed, torn, or after reassembling the unit for upgrades; fresh pads ensure proper contact with the chassis heatsink.
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