UPSIREN OEM 16W/mK Thermal Pad 100x100x3.0mm 23g

Thermal pad for high-power components

This UPSIREN OEM thermal pad measures 100 x 100 x 3.0 mm and weighs 23 g. It provides a thermal conductivity of 16 W/mK for transferring heat from CPUs, GPUs or LED modules to their heatsinks. The silicone material remains stable across a long-term operating range of -40 to 200 °C. It suits builders who need a single, reusable interface for high-heat applications.

Non-conductive silicone with 30-degree hardness

The pad is non-conductive, non-corrosive, non-curing and non-toxic, so it poses no electrical risk if it contacts exposed circuitry. Its 30-degree hardness makes it soft and compressible, allowing it to conform closely to uneven chip surfaces without excessive pressure. Natural viscosity holds it in place during assembly, yet it can be removed and reused when maintenance is required. The material also resists fire, static, wear and corrosion.

Replaces thermal paste where gaps are larger

This pad replaces thermal grease in situations where a thicker, gap-filling interface is needed between a heating element and its heatsink. The jump is worth it when components sit unevenly or when a durable, mess-free layer that will not pump out or dry over time is preferred. It is not suited for buyers who need a sub-millimetre bond line or the absolute lowest thermal resistance that only a thin paste layer can achieve.