ASUS
ASUS EX-B860M-V5/SI Intel motherboard & Ultra 7 265K CPU combo
Pre-built combo pairs an LGA 1851 motherboard with an Intel Ultra 7 265K processor and Shin-Etsu thermal paste
- CPU Socket TypeLGA 1851
model EX-B860M-V5/SI
- EX-B860M-V5/SI
- ROG STRIX B860-I GAMING WIFI
- ROG STRIX B860-F GAMING WIFI
- ROG STRIX B860-G GAMING WIFI S
- ROG STRIX B860-A GAMING WIFI S
- TUF GAMING B860M-PLUS WIFI
- TUF GAMING B860M-PLUS
- TUF GAMING B860-PLUS WIFI
- PRIME B860M-K
- PRIME B860M-A WIFI
- PRIME B860M-A
- PRIME B860-PLUS WIFI
3 yapılandırma daha gösterin
+CPU +Ultra 7 265K
- +Ultra 5 245K
- +Ultra 7 265K
- +Ultra 9 285K
- Ready-to-build combo includes motherboard, CPU and Shin-Etsu X-23-7868-2D thermal paste
- Intel Ultra 7 265K delivers 30 MB L3 and 36 MB L2 cache for responsive multitasking
- Luminous anti-moisture coating plus 8-pin ProCool connector protects components in humid environments
- Two PCIe 4.0 x16 slots and two M.2 sockets give flexible GPU and storage expansion
- Realtek 2.5 Gbps LAN passes ASUS iCafé Lab reboot and diskless compatibility certification
Ready-to-run motherboard and CPU bundle
The ASUS EX-B860M-V5/SI board ships paired with an Intel Core Ultra 7 265K processor and a tube of Shin-Etsu X-23-7868-2D thermal grease. The LGA 1851 socket matches the CPU exactly so the combination works straight from the box. It targets internet-café operators and builders who want a pre-validated platform for long gaming sessions.
Straightforward installation with a few watch points
The processor drops into the LGA 1851 socket without force and the supplied grease spreads easily thanks to its 100 Pa·s viscosity and 6.2 W/m·K conductivity. The board uses an 8-pin ProCool power connector that seats firmly but requires even pressure to avoid bent pins. SafeSlot Core+ reinforces the primary PCIe 4.0 x16 slot yet heavy graphics cards still need a support bracket to prevent long-term sag.
Verify your chassis, cooling
The micro-ATX form factor fits most mid-tower cases but confirm the motherboard tray has the correct standoff pattern. The CPU carries a 125 W base rating and ships without a cooler so a capable air or liquid solution rated for that heat load is mandatory. The two M.2 slots and two PCIe 4.0 x16 slots share bandwidth so populate them according to the manual to keep the Realtek 2.5G LAN and SATA ports active.
Öne çıkanlar
- Ready-to-build combo includes motherboard, CPU and Shin-Etsu X-23-7868-2D thermal paste
- Intel Ultra 7 265K delivers 30 MB L3 and 36 MB L2 cache for responsive multitasking
- Luminous anti-moisture coating plus 8-pin ProCool connector protects components in humid environments
- Two PCIe 4.0 x16 slots and two M.2 sockets give flexible GPU and storage expansion
- Realtek 2.5 Gbps LAN passes ASUS iCafé Lab reboot and diskless compatibility certification
Teknik özellikler
| Brand | ASUS |
|---|---|
| Model | EX-B860M-V5/SI+Ultra 7 265K |
| CPU Socket Type | LGA 1851 |
Bu modelin diğer sürümleri
Aynı seriden 5 tane daha
Aynı aile, farklı bellek, soğutucu veya frekans — karar vermeden önce karşılaştırın.
ASUS TUF GAMING B860M-PLUS + Intel Ultra 5 245K Intel motherboard combo
- LGA 1851
ASUS TUF GAMING B860M-PLUS WIFI Intel motherboard Ultra 5 245K combo
- LGA 1851
- Intel B860
Bu ürünle ilgili sorular
How do I confirm the combo is running correctly after assembly?
Verify the system posts, shows the Ultra 7 265K in BIOS, reports DDR5 memory speed, detects both M.2 drives and the Realtek 2.5G LAN, and boots into Windows without reboot loops.
What ships in the combo box and what must I purchase separately?
The package contains the EX-B860M-V5/SI motherboard, Intel Ultra 7 265K processor, and Shin-Etsu X-23-7868-2D thermal grease; you still need DDR5 memory, storage drives, a graphics card, power supply, chassis and CPU cooler.
Which capacity of the Shin-Etsu X-23-7868-2D paste should I choose for this build?
The syringe included in the combo is sized for a single CPU application; its 6.2 W/m.k conductivity and 0.07 °C·cm²/W resistance cover the Ultra 7 265K heatspreader, so no extra tube is required.
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