Thermalright MC-2 ARGB Memory Cooler White 3200 RPM
- Fan & Heatsinks
- DDR/DDR2/DDR3/DDR4/…
Me võtame vastu krüptoraha — nii saab teie hoitav krüptoraha osta päris riistvara.Makske krüptorahaga, kulutage seda päris riistvarale. Tasuta kindlustatud tarne kogu maailmas, üle 399 $. Lihtsad, kaubamärgita väliskarbid, saadetud Saksamaalt.Tasuta kindlustatud tarne üle 399 $. Teie kurss lukustatakse 30 minutiks kohe, kui kassa avaneb.Kurss lukustatud 30 minutiks. Iga toode on pitseeritud, selle seerianumber on kontrollitud ja sellel kehtib 24-kuuline garantii.Pitseeritud, 24-kuulise garantiiga.
Dynatron
Copper 1100 heatsink with skiving fins cools AMD EPYC SP3 CPUs up to 120 W in a 25.5 mm 1U profile
The Dynatron A25 is a copper 1100 heatsink with skiving fins designed for AMD Socket SP3 processors. It supports EPYC CPUs with a thermal design power up to 120 watts. The unit measures 113.00 by 77.50 by 25.50 millimetres and weighs 450 grams. It is built for 1U server deployments where vertical clearance is limited.
Installation uses a horizontal fan mounting orientation that matches standard 1U chassis airflow paths. Shin-Etsu 7762 thermal grease is pre-printed on the base, removing the need for manual application and reducing the risk of uneven coverage. The low 25.5 millimetre height leaves no margin for taller components; verify chassis clearance before fitting. Copper 1100 construction adds mass, so ensure the motherboard mounting points are secure.
The 25.5 millimetre Z-height restricts fan selection to low-profile models and caps cooling capacity at 120 watts. Horizontal mounting forces air across the fin stack rather than through it, which can reduce efficiency compared to vertical tower designs. The fixed footprint of 113.00 by 77.50 millimetres may conflict with nearby memory slots or voltage regulators on dense server boards. Buyers needing higher thermal headroom or taller coolers cannot use this model.
| Brand | Dynatron |
|---|---|
| Model | A25 |
| Type | Heatsinks only |
| CPU Socket Compatibility | AMD Socket SP3 |
| Heatsink Material | Copper 1100 with Skiving Fin |
| Fan Mounting Types to Heatsink | Horizontal |
| Max CPU Cooler Height | 25.5 mm |
| Heatsink Dimensions | 113.00 x 77.50 x 25.50 mm |
| Weight | 450g |
| Features | CPU Support: AMD EPYC Solution: 1U Server and Up Thermal Grease : Shin-Etsu 7762 Pre-printed |
| Tarnekaal | 0.63 kg |
| Pakendi mõõtmed | 142 × 117 × 58 mm |
Monitor CPU temperatures under load using system software; the cooler is rated for up to 120 W TDP and Shin-Etsu 7762 thermal grease is pre-printed on the copper 1100 base for immediate conductivity.
The package contains the copper 1100 skiving-fin heatsink measuring 113.00 x 77.50 x 25.50 mm weighing 450 g with pre-applied Shin-Etsu 7762 grease; a compatible 1U server fan for horizontal mounting is not included.
Only the single A25 model exists — it fits AMD Socket SP3, supports EPYC CPUs up to 120 W, and its 25.5 mm height meets 1U clearance requirements.
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