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Copper 1100 skived-fin heatsink, 113 by 77.5 by 25.5 mm, horizontal fan mount

Dynatron

Dynatron A25 AMD SP3 Copper 1100 Skiving Fin 1U 120W 25.5mm

SKU CH-X9CJ-JKK6V MPN A25

Copper 1100 heatsink with skiving fins cools AMD EPYC SP3 CPUs up to 120 W in a 25.5 mm 1U profile

  • TypeHeatsinks only
  • CPU Socket CompatibilityAMD Socket SP3
  • Heatsink MaterialCopper 1100 with Skiving Fin
  • Fan Mounting Types to HeatsinkHorizontal
  • Max CPU Cooler Height25.5 mm
  • Heatsink Dimensions113.00 x 77.50 x 25.50 mm
  • Fits 1U server racks with 25.5 mm low-profile height
  • Cools AMD EPYC processors up to 120 W TDP
  • Copper 1100 skiving-fin construction transfers heat efficiently
  • Horizontal fan mounting directs airflow across dense fin array
  • Shin-Etsu 7762 thermal compound pre-applied for immediate installation

AMD SP3 Copper 1100 1U Cooler

The Dynatron A25 is a copper 1100 heatsink with skiving fins designed for AMD Socket SP3 processors. It supports EPYC CPUs with a thermal design power up to 120 watts. The unit measures 113.00 by 77.50 by 25.50 millimetres and weighs 450 grams. It is built for 1U server deployments where vertical clearance is limited.

Horizontal Fan Mount and Pre-Printed Grease

Installation uses a horizontal fan mounting orientation that matches standard 1U chassis airflow paths. Shin-Etsu 7762 thermal grease is pre-printed on the base, removing the need for manual application and reducing the risk of uneven coverage. The low 25.5 millimetre height leaves no margin for taller components; verify chassis clearance before fitting. Copper 1100 construction adds mass, so ensure the motherboard mounting points are secure.

25.5 Millimetre Height Limits Airflow Options

The 25.5 millimetre Z-height restricts fan selection to low-profile models and caps cooling capacity at 120 watts. Horizontal mounting forces air across the fin stack rather than through it, which can reduce efficiency compared to vertical tower designs. The fixed footprint of 113.00 by 77.50 millimetres may conflict with nearby memory slots or voltage regulators on dense server boards. Buyers needing higher thermal headroom or taller coolers cannot use this model.

Najważniejsze cechy

  • Fits 1U server racks with 25.5 mm low-profile height
  • Cools AMD EPYC processors up to 120 W TDP
  • Copper 1100 skiving-fin construction transfers heat efficiently
  • Horizontal fan mounting directs airflow across dense fin array
  • Shin-Etsu 7762 thermal compound pre-applied for immediate installation

Specyfikacja

BrandDynatron
ModelA25
TypeHeatsinks only
CPU Socket CompatibilityAMD Socket SP3
Heatsink MaterialCopper 1100 with Skiving Fin
Fan Mounting Types to HeatsinkHorizontal
Max CPU Cooler Height25.5 mm
Heatsink Dimensions113.00 x 77.50 x 25.50 mm
Weight450g
FeaturesCPU Support: AMD EPYC
Solution: 1U Server and Up
Thermal Grease : Shin-Etsu 7762 Pre-printed
Waga przesyłki0.63 kg
Wymiary opakowania142 × 117 × 58 mm

Pytania dotyczące tego produktu

How do I verify the Dynatron A25 is cooling my AMD EPYC processor correctly after installation?

Monitor CPU temperatures under load using system software; the cooler is rated for up to 120 W TDP and Shin-Etsu 7762 thermal grease is pre-printed on the copper 1100 base for immediate conductivity.

What components are included with the Dynatron A25 and what must be purchased separately?

The package contains the copper 1100 skiving-fin heatsink measuring 113.00 x 77.50 x 25.50 mm weighing 450 g with pre-applied Shin-Etsu 7762 grease; a compatible 1U server fan for horizontal mounting is not included.

Which version of the Dynatron A25 should I choose for a 1U AMD SP3 server build?

Only the single A25 model exists — it fits AMD Socket SP3, supports EPYC CPUs up to 120 W, and its 25.5 mm height meets 1U clearance requirements.

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