NVIDIA
NVIDIA Tesla P4 8 GB GDDR5 Low-Profile Supermicro 900-2G414-6300-000
An 8 GB GDDR5 inference accelerator with 256 CUDA cores, 5.5 TeraFLOPS single-precision and 22 TOPS INT8 in a 75 W low-profile passive design
- Memory TypeGDDR5
- 8 GB GDDR5 memory accelerates inference workloads
- 5 TFLOPS single-precision compute handles demanding calculations
- 22 TOPS INT8 performance speeds up AI inference
- 75 W max power fits dense server deployments
- Passive heatsink enables silent operation in data centres
Data-centre inference card
The NVIDIA Tesla P4 is an 8 GB GDDR5 accelerator built for low-profile servers. It targets teams running inference workloads that need hardware decode and encode engines in a passive design. The card delivers 5.5 teraflops of single-precision compute and 22 TOPS of INT8 throughput. Its 75 W ceiling keeps thermal budgets tight.
Upgrade from CPU-only inference
The jump makes sense when batch video transcoding or real-time analytics saturate host processors. Pascal architecture brings 256 CUDA cores and 192 GB/s memory bandwidth to offload those pipelines. Page Migration Engine and ECC protection add stability for long-running jobs. Buyers who need active cooling or double-slot height should look elsewhere.
Passive low-profile installation
The board slides into any low-profile PCI Express slot without auxiliary power cables. Rack airflow must satisfy the 75 W passive heatsink or throttling will occur. Brackets for full-height chassis are not included. Supermicro part 900-2G414-6300-000 confirms the exact mechanical fit.
Põhijooned
- 8 GB GDDR5 memory accelerates inference workloads
- 5 TFLOPS single-precision compute handles demanding calculations
- 22 TOPS INT8 performance speeds up AI inference
- 75 W max power fits dense server deployments
- Passive heatsink enables silent operation in data centres
Tehnilised andmed
| Memory Type | GDDR5 |
|---|
Küsimused selle toote kohta
Will the low-profile PCI Express form factor fit in a 1U server chassis?
The card uses a low-profile PCI Express form factor and a passive heatsink, so it fits in 1U and other slim chassis without needing extra vertical clearance.
Does the passive heatsink need case airflow, or can it run in a sealed enclosure?
The 75 W max power is dissipated through the passive heatsink; it requires directed airflow from server fans and cannot operate reliably in a sealed or fanless enclosure.
When should the thermal interface material on the passive heatsink be replaced?
In continuous data-centre use, plan to inspect and replace the thermal interface material every two to three years to maintain the 75 W thermal limit.
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