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NVIDIA

NVIDIA Tesla P4 8 GB GDDR5 Low-Profile Supermicro 900-2G414-6300-000

SKU CH-DDM4-XVPD5

An 8 GB GDDR5 inference accelerator with 256 CUDA cores, 5.5 TeraFLOPS single-precision and 22 TOPS INT8 in a 75 W low-profile passive design

  • Memory TypeGDDR5
  • 8 GB GDDR5 memory accelerates inference workloads
  • 5 TFLOPS single-precision compute handles demanding calculations
  • 22 TOPS INT8 performance speeds up AI inference
  • 75 W max power fits dense server deployments
  • Passive heatsink enables silent operation in data centres

Data-centre inference card

The NVIDIA Tesla P4 is an 8 GB GDDR5 accelerator built for low-profile servers. It targets teams running inference workloads that need hardware decode and encode engines in a passive design. The card delivers 5.5 teraflops of single-precision compute and 22 TOPS of INT8 throughput. Its 75 W ceiling keeps thermal budgets tight.

Upgrade from CPU-only inference

The jump makes sense when batch video transcoding or real-time analytics saturate host processors. Pascal architecture brings 256 CUDA cores and 192 GB/s memory bandwidth to offload those pipelines. Page Migration Engine and ECC protection add stability for long-running jobs. Buyers who need active cooling or double-slot height should look elsewhere.

Passive low-profile installation

The board slides into any low-profile PCI Express slot without auxiliary power cables. Rack airflow must satisfy the 75 W passive heatsink or throttling will occur. Brackets for full-height chassis are not included. Supermicro part 900-2G414-6300-000 confirms the exact mechanical fit.

特長

  • 8 GB GDDR5 memory accelerates inference workloads
  • 5 TFLOPS single-precision compute handles demanding calculations
  • 22 TOPS INT8 performance speeds up AI inference
  • 75 W max power fits dense server deployments
  • Passive heatsink enables silent operation in data centres

仕様

Memory TypeGDDR5

この商品に関する質問

Will the low-profile PCI Express form factor fit in a 1U server chassis?

The card uses a low-profile PCI Express form factor and a passive heatsink, so it fits in 1U and other slim chassis without needing extra vertical clearance.

Does the passive heatsink need case airflow, or can it run in a sealed enclosure?

The 75 W max power is dissipated through the passive heatsink; it requires directed airflow from server fans and cannot operate reliably in a sealed or fanless enclosure.

When should the thermal interface material on the passive heatsink be replaced?

In continuous data-centre use, plan to inspect and replace the thermal interface material every two to three years to maintain the 75 W thermal limit.

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