UOTEK UT-885 USB to RS-485 RS-422 Converter 5-pin Terminal Block
- CONVERTER
- Black
Me võtame vastu krüptoraha — nii saab teie hoitav krüptoraha osta päris riistvara.Makske krüptorahaga, kulutage seda päris riistvarale. Tasuta kindlustatud tarne kogu maailmas, üle 399 $. Lihtsad, kaubamärgita väliskarbid, saadetud Saksamaalt.Tasuta kindlustatud tarne üle 399 $. Teie kurss lukustatakse 30 minutiks kohe, kui kassa avaneb.Kurss lukustatud 30 minutiks. Iga toode on pitseeritud, selle seerianumber on kontrollitud ja sellel kehtib 24-kuuline garantii.Pitseeritud, 24-kuulise garantiiga.
Thermal Grizzly
Liquid metal thermal compound with 73 W/mK conductivity for experienced users seeking maximum heat dissipation between 10 and 140 °C
Thermal Grizzly Conductonaut TG-C-005-R is a liquid metal thermal compound rated at 73 W/mK. The 5.0 g syringe uses a eutectic alloy of tin, gallium and indium for maximum heat transfer between a CPU or GPU die and a nickel-plated copper cold plate.
This paste suits enthusiasts who are comfortable handling electrically conductive liquid metal and who can ensure it will not contact aluminium surfaces. Builders who prefer a non-conductive ceramic or silicone grease, or who need a compound safe for bare aluminium heat spreaders, should choose a different product.
The bundled plastic needle lets you place a thin, controlled line of the low-viscosity compound directly on the die. This reduces the risk of overflow onto the substrate or socket area, which is critical because the material conducts electricity and can cause short circuits if it bridges pins.
| Brand | Thermal Grizzly |
|---|---|
| Model | TG-C-005-R |
| Volume / Net Weight | 5.0g |
| Thermal Conductivity | 73 W/mK |
| Long Term Operating Temperature | 10 to 140 C |
| Specifications | Viscosity: 0.0021 Pas Density: 6.24g/cm3 Consistency: Liquid |
| Features | Ultra high thermal conductivity Increased indium content Easy application with synthetic needle |
Thermal Grizzly recommends a nickel-plated copper heat-spreader for best long-term stability with this liquid metal compound.
Liquid metal alloys can react with bare aluminium, so the Conductonaut should only contact nickel-plated copper or similar compatible surfaces.
Monitor CPU core temperatures under load; they should drop noticeably compared with conventional paste and stay within the 10 to 140 °C operating window.
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