UOTEK UT-885 USB to RS-485 RS-422 Converter 5-pin Terminal Block
- CONVERTER
- Black
Sprejemamo kriptovalute — tako lahko sredstva, ki jih imate, kupijo pravo strojno opremo.Plačajte v kriptovaluti, zapravite jo za pravo strojno opremo. Brezplačna zavarovana dostava po vsem svetu nad 399 $. Nevtralni kartoni brez znamke, poslani iz Nemčije.Brezplačna zavarovana dostava nad 399 $. Vaš tečaj je zaklenjen za 30 minut, takoj ko se odpre blagajna.Tečaj zaklenjen 30 minut. Vsak izdelek je zapečaten, njegova serijska številka preverjena, in krit z 24-mesečno garancijo.Zapečateno, 24-mesečna garancija.
Thermal Grizzly
Liquid metal thermal compound with 73 W/mK conductivity for experienced users seeking maximum heat dissipation between 10 and 140 °C
Thermal Grizzly Conductonaut TG-C-005-R is a liquid metal thermal compound rated at 73 W/mK. The 5.0 g syringe uses a eutectic alloy of tin, gallium and indium for maximum heat transfer between a CPU or GPU die and a nickel-plated copper cold plate.
This paste suits enthusiasts who are comfortable handling electrically conductive liquid metal and who can ensure it will not contact aluminium surfaces. Builders who prefer a non-conductive ceramic or silicone grease, or who need a compound safe for bare aluminium heat spreaders, should choose a different product.
The bundled plastic needle lets you place a thin, controlled line of the low-viscosity compound directly on the die. This reduces the risk of overflow onto the substrate or socket area, which is critical because the material conducts electricity and can cause short circuits if it bridges pins.
| Brand | Thermal Grizzly |
|---|---|
| Model | TG-C-005-R |
| Volume / Net Weight | 5.0g |
| Thermal Conductivity | 73 W/mK |
| Long Term Operating Temperature | 10 to 140 C |
| Specifications | Viscosity: 0.0021 Pas Density: 6.24g/cm3 Consistency: Liquid |
| Features | Ultra high thermal conductivity Increased indium content Easy application with synthetic needle |
Thermal Grizzly recommends a nickel-plated copper heat-spreader for best long-term stability with this liquid metal compound.
Liquid metal alloys can react with bare aluminium, so the Conductonaut should only contact nickel-plated copper or similar compatible surfaces.
Monitor CPU core temperatures under load; they should drop noticeably compared with conventional paste and stay within the 10 to 140 °C operating window.
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