Black Diamond Memory BD8G2666MQN22 8GB DDR4 2666 laptop RAM
- 8GB
- 260-Pin DDR4 SO-DIMM
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Black Diamond Memory
64 GB kit of two 32 GB DDR4 2666 SO-DIMM modules with CL19 latency for laptop upgrades
Capacity 64GB (2 x 32GB)
This kit provides 64 GB in two 32 GB SO-DIMMs built to the 260-pin DDR4 2666 (PC4 21300) standard with CL19 latency. It targets laptop owners and system integrators who need the maximum factory-supported density in a dual-channel layout.
Black Diamond Memory states the modules are validated across over 200000 platform configurations covering enterprise servers, desktops and laptops. That breadth of testing is intended to reduce first-boot failures and eliminate the trial-and-error phase when upgrading mixed fleets.
The standard 260-pin edge connector and JEDEC-height PCB ensure mechanical compatibility with any SO-DIMM slot wired for DDR4 2666. No heat-spreader overhang or tall components are present, so the sticks clear tight chassis cavities and stacked board layouts without modification.
| Brand | Black Diamond Memory |
|---|---|
| Model | BD32GX22666MQN28 |
| Capacity | 64GB (2 x 32GB) |
| Type | 260-Pin DDR4 SO-DIMM |
| Speed | DDR4 2666 (PC4 21300) |
| CAS Latency | CL19 |
| Features | With decades of experience specializing in memory and server parts, Black Diamond Memory is a proven manufacturer in the industry. Our products currently support over 200,000 configurations as well as support for enterprise servers, desktops, laptops, and a large variety of other devices. |
| Težina pošiljke | 0.18 kg |
| Dimenzije pakiranja | 127 × 51 × 13 mm |
Druge verzije ovog modela
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The CL19 timing is a fixed hardware specification; DDR4 SO-DIMMs have no moving parts or user-serviceable components, so no maintenance or replacement of the latency setting is required.
Sustained operation is bounded by the DDR4 2666 (PC4 21300) speed rating and CL19 latency; the memory controller will throttle before the modules exceed their validated frequency envelope.
Standard DDR4 SO-DIMMs operate at low voltage with no active cooling; typical power draw stays within the JEDEC envelope for 260-pin laptop modules, and heat output remains modest during continuous use.
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