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Dell PowerEdge R730 2U rack server front view with bezel and eight drive bays

DELL

DELL PowerEdge R730 2U Rack Server 2x Xeon E5-2699 v3 2.3GHz 18-Core 512GB DDR4 H730 2x 300GB SAS

SKU CH-2TKW-YJC3Z

A 2U rack server with dual 18-core Xeon processors at 2.3 GHz, 512 GB DDR4 memory, a PERC H730 RAID controller, and two 300 GB SAS drives

  • TypeRack
  • Rack Height2U
  • Redundant Hot-swap PowerYes
  • CPU TypeIntel Xeon
  • CPU Speed2.30 GHz
  • CPU SocketLGA 2011-3

Installed Memory Size 512GB

HDD 2 x 300GB 10K SAS

  • Dual 18-core Xeon processors at 2.3 GHz base with 3.6 GHz turbo handle heavy compute
  • 512 GB DDR4 ECC memory across 16 slots supports large virtualisation workloads
  • PERC H730 controller with 1 GB cache enables RAID 0, 1, 5, 6, 10, 50, 60
  • Dual 10 Gb SFP+ and dual 1 GbE ports provide flexible network connectivity
  • iDRAC 8 Enterprise gives full remote management with redundant 750 W platinum power supplies

Built for heavy enterprise workloads

The PowerEdge R730 is a 2U rack server equipped with two Intel Xeon E5-2699 v3 processors. Each CPU delivers 18 cores at 2.3 GHz with a 3.6 GHz turbo frequency. The system ships with 512 GB of DDR4 2133 MHz registered ECC memory across 16 modules. It targets midsize and large organisations running databases, virtual desktop infrastructure, data warehousing or high-performance computing nodes.

Dense 2.5-inch bay layout with quad-port networking

Eight front-accessible 2.5-inch drive bays connect to a Dell PERC H730 1 GB controller supporting SAS and SATA with RAID levels 0, 1, 5, 6, 10, 50 and 60. Two 300 GB 10 K SAS drives are installed. A quad-port Intel X520/I350 daughter card adds two 1 GbE and two 10 Gb SFP+ connections. iDRAC 8 Enterprise provides dedicated remote management. ReadyRails and a front bezel are included for standard rack mounting.

Dual 750 W platinum supplies handle peak power

Redundant hot-swap 750 W platinum-efficiency power supplies share the load from both CPUs, memory, storage and networking. The 2U chassis uses front-to-rear airflow tuned for rack density. Under typical enterprise workloads the cooling system maintains stable temperatures while the platinum units keep power draw efficient. The 1.5 TB maximum memory headroom allows future expansion without changing the power infrastructure.

Istaknuto

  • Dual 18-core Xeon processors at 2.3 GHz base with 3.6 GHz turbo handle heavy compute
  • 512 GB DDR4 ECC memory across 16 slots supports large virtualisation workloads
  • PERC H730 controller with 1 GB cache enables RAID 0, 1, 5, 6, 10, 50, 60
  • Dual 10 Gb SFP+ and dual 1 GbE ports provide flexible network connectivity
  • iDRAC 8 Enterprise gives full remote management with redundant 750 W platinum power supplies

Specifikacije

BrandDELL
SeriesPowerEdge R730
ModelR730
TypeRack
Rack Height2U
Redundant Hot-swap PowerYes
CPU TypeIntel Xeon
CPU Speed2.30 GHz
CPU SocketLGA 2011-3
Number of CPU Cores18-Core Processor
# of Processors Installed2
MAX Processors2
ChipsetIntel C610
Installed Memory Size512GB
Memory TypeDDR4
Max Memory Capacity1.5TB
Number of Memory Slots24
Storage ControllerDell Perc H730 1GB Controller
HDD InterfaceSAS
SSD (Installed)No
Raid LevelRAID 0/1/5/6/10/50/60
GPU TypeMatrox G200
Video Memory8MB
Ethernet ControllerDell Intel X520/I350 Quad Port 2x 1GbE 2x 10Gb SFP+ Network Daughter Card
LAN Ports4 x Ports
Expansion Slots1 x PCIe 3.0 x16 Slot, Single Riser Included (Riser 3)
Management PortRJ 45
Operating SystemNo
Features8 x 2.5" SATA/SAS Hot-Plug Drive Bays

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What SAS speed does the PERC H730 controller support, and how does that limit the installed drives?

The PERC H730 is a 12Gb/s SAS controller, so the two 300GB 10K SAS drives run at their full 12Gb/s interface speed.

What rack depth and rail kit are required to mount this 2U server?

The server includes Dell Ready Rails sliding rails, which mount in standard 4-post racks with adjustable depth; verify your rack depth range matches the rail specification.

How are the two Xeon E5-2699 v3 processors installed, and what common step is missed?

Both LGA 2011-3 sockets are populated; the critical step often missed is applying thermal paste and torquing the heatsink retention screws in the correct diagonal sequence.

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