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Praćeni artikli Prijava
Silver aluminium passive heatsink with vertical fins, 2U low-profile design

Dynatron

Dynatron G618 LGA1366 Passive 2U CPU Cooler

SKU CH-05R4-R0415

Passive 2U heatsink fits Intel LGA1366 sockets in slim servers

  • TypeHeatsinks only
  • Passive design eliminates fan noise for quiet operation
  • 2U form factor fits low-profile server chassis
  • Engineered for Intel LGA 1366 socket compatibility
  • Dynatron G618 model built as heatsink-only cooler

Socket 1366 passive heatsink

The Dynatron G618 is a 2U passive heatsink designed for Intel LGA1366 processors. It mounts directly onto the socket without a fan, making it suitable for servers and workstations where moving parts are avoided. The unit targets administrators who need silent, maintenance-free cooling in rack environments. It is not intended for builds that require active airflow or overclocking headroom.

Thermals and power without a fan

Heat dissipation relies entirely on case airflow moving across the aluminium fins. In a properly ventilated 2U chassis the cooler handles typical server workloads without adding acoustic noise. Power draw is zero because no fan is present. Performance will drop if the chassis lacks directed airflow or if the processor exceeds the cooler's passive thermal capacity.

Istaknuto

  • Passive design eliminates fan noise for quiet operation
  • 2U form factor fits low-profile server chassis
  • Engineered for Intel LGA 1366 socket compatibility
  • Dynatron G618 model built as heatsink-only cooler

Specifikacije

TypeHeatsinks only

Pitanja o ovom artiklu

How do I mount the G618 passive heatsink onto an LGA1366 socket, and which step do people often get wrong?

Fasten the supplied brackets through the motherboard's four mounting holes in a diagonal pattern; the common mistake is tightening one corner fully before the others, which warps the base and reduces contact.

What maintenance will the G618 passive cooler need over its service life?

Because it has no fan, the only upkeep is periodic dust removal from the fin stack using compressed air or a soft brush to maintain airflow through the 2U chassis.

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