Thermalright MC-2 ARGB Memory Cooler White 3200 RPM
- Fan & Heatsinks
- DDR/DDR2/DDR3/DDR4/…
Prihvaćamo kriptovalute — tako kriptovalute koje posjedujete mogu kupiti pravi hardver.Plaćajte kriptovalutom, trošite je na pravi hardver. Besplatna osigurana dostava diljem svijeta iznad 399 $. Obični vanjski kartoni bez oznaka, otpremaju se iz Njemačke.Besplatna osigurana dostava iznad 399 $. Vaš je tečaj blokiran 30 minuta od otvaranja blagajne.Tečaj blokiran 30 minuta. Svaki je artikl zapečaćen, njegov serijski broj provjeren, i pokriven jamstvom od 24 mjeseca.Zapečaćen, jamstvo 24 mjeseca.
Dynatron
Copper heatsink for Intel Core i5-750, i7-860, i7-870 and Xeon 3400 series CPUs
The Dynatron K129 is a passive copper heatsink measuring 90.0 x 90.0 x 26.5 mm and weighing 490g. It is designed for Intel Core i5 I5-750, Core i7 I7-860, Core i7 I7-870 and Xeon Processor 3400 Series processors.
This cooler suits technicians replacing a missing or damaged heatsink on systems running the specific Intel models named above. It is not for builders assembling new platforms, users needing active fan cooling, or anyone whose processor is not explicitly listed in the supported CPU lineup.
The solid copper heatsink material provides the thermal mass and conductivity for these specific legacy processors. Buyers must verify their exact CPU model matches the supported list before purchase, as no other compatibility is implied.
| Brand | Dynatron |
|---|---|
| Model | K129 |
| Type | Heatsinks only |
| Heatsink Material | Copper |
| Heatsink Dimensions | 90.0 x 90.0 x 26.5 mm |
| Weight | 490g ± 5g |
| Features | CPU Support: Intel Core i5 I5-750; Xeon Processor 3400 Series; Core i7 Processors, I7-870 & I7-860 |
| Težina pošiljke | 0.61 kg |
| Dimenzije pakiranja | 138 × 121 × 46 mm |
The heatsink measures 90.0 x 90.0 x 26.5 mm and weighs 490g, so check your motherboard keep-out zone against those dimensions before fitting.
The K129 lists the Xeon 3400 series and Core i7-860 and i7-870 as supported CPUs, so the cooler is designed for those processors.
Verify the copper base makes full contact with the CPU heatspreader and that the 90.0 x 90.0 mm footprint sits flat within the socket retention frame.
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