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HP ProLiant ML330 G6 5U tower server, neutral finish

HP

HP E5603 Xeon 1.60 GHz 2 GB DDR3 rack server

SKU CH-FBG9-124C2 MPN E5603

Quad-core Xeon tower server with 2 GB DDR3 memory and twelve DIMM slots for expansion

  • TypeTower
  • Quad-core Xeon handles multi-thread workloads
  • 60 GHz clock keeps power draw low
  • 2 GB DDR3-1333 memory installed
  • 12 DIMM slots allow large capacity upgrades
  • Intel 5500 chipset supports dual-processor configuration

HP ProLiant ML330 G6 tower server

The HP ProLiant ML330 G6 is a 5U tower server built around a single Intel Xeon E5603 quad-core processor running at 1.60 GHz. It ships with 2 GB of DDR3-1333 memory across twelve available slots. The Intel 5500 chipset provides a 4.80 GT/s QuickPath Interconnect. This system suits small businesses or remote offices needing a dependable on-premise platform for file, print or lightweight application services.

Thermals noise and power draw

As a 5U tower chassis, the ML330 G6 uses multiple internal fans to move air across the processor and memory regions. The larger form factor allows lower fan speeds than dense rack units, reducing audible noise in office environments. Power consumption scales with the single installed CPU and the current 2 GB memory configuration, leaving headroom within the redundant supply for additional components.

Maximum memory capacity

Twelve DIMM slots support DDR3-1333/PC3-10600 modules, enabling substantial memory expansion beyond the factory 2 GB. This capacity ceiling determines whether the server can host virtualised workloads, databases or terminal services that demand large RAM footprints. Buyers who need more storage bays or a second processor socket should evaluate other chassis options.

Istaknuto

  • Quad-core Xeon handles multi-thread workloads
  • 60 GHz clock keeps power draw low
  • 2 GB DDR3-1333 memory installed
  • 12 DIMM slots allow large capacity upgrades
  • Intel 5500 chipset supports dual-processor configuration

Specifikacije

TypeTower

Pitanja o ovom artiklu

How do I install the second Xeon E5603 in the ML330 G6, and which step is often missed?

Fit the second processor into the empty socket, apply the supplied thermal interface, then attach its dedicated heatsink and fan; the step most people skip is connecting the second CPU fan header so the system can monitor both thermals.

What memory maintenance will the ML330 G6 need as the DDR3 DIMMs age?

Plan to reseat or replace DDR3 modules if ECC errors rise; the board has 12 slots supporting DDR3-1333/PC3-10600, so you can add pairs or swap faulty sticks without replacing the whole set.

Which limit appears first when the ML330 G6 runs a sustained heavy load on its single E5603?

The 4 MB L3 cache and 4.80 GT/s QuickPath link saturate before the four 1.60 GHz cores hit a hard thermal wall, so memory-bound workloads stall first.

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