NEMIX RAM 16GB (2x8GB) DDR5 5600 CL46 1.1V UDIMM memory upgrade for Supermicro X13SAE
- 16GB (2 x 8GB)
- 288-Pin DDR5 UDIMM
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NEMIX RAM
32 GB DDR5 kit with two 16 GB modules running at 5600 MT/s, CL46, 1.1 V for the NZXT N7 B850 motherboard
Size 32GB 2X16GB
This 32 GB kit contains two 16 GB DDR5 5600 UDIMMs built to the NZXT N7 B850 motherboard's native specifications. It uses the 288-pin unbuffered non-ECC form factor and 1Rx8 rank organisation that the board expects, so the memory controller recognises the full capacity at rated speed.
Operating at 1.1 V with CL46 timing, the modules run at standard DDR5 voltage without a heat spreader. Power draw stays within the JEDEC baseline for 5600 MT/s UDIMMs, and the bare PCB design produces no additional acoustic load beyond the system's existing airflow.
The kit replaces lower-capacity or slower DDR5 modules when the NZXT N7 B850 platform needs 32 GB at its supported 5600 MT/s rate. It is not for systems that require ECC, registered DIMMs, or a different DDR generation, and it does not suit boards limited to lower maximum densities or speeds.
| Brand | NEMIX RAM |
|---|---|
| Series | NEMIX RAM Original Series Memory |
| Model | DDR5 Non-ECC Unbuffered UDIMM Memory |
| Part Number | MD44800-618K2 |
| Capacity | 32GB (2 x 16GB) |
| Type | 288-Pin DDR5 UDIMM |
| Speed | DDR5 5600 (PC5 44800) |
| CAS Latency | CL46 |
| Voltage | 1.10V |
| ECC | No |
| Buffered/Registered | Unbuffered |
| Rank | 1Rx8 |
| Chipset | Major OEM Samsung, Micron, Hynix |
| Heat Spreader | No |
| Compatible System | NZXT |
| Features | DDR5 Non-ECC Unbuffered UDIMM Motherboard Compatible |
| Package Content | 32GB 2X16GB DDR5 5600MHz PC5-44800 1Rx8 1.1V 288-PIN Non-ECC UDIMM KIT |
Druge verzije ovog modela
Ista obitelj, različita memorija, hladnjak ili frekvencija — usporedite prije kupnje.
Insert the first module into the DIMM slot the manual labels primary for single-channel boot, then add the second in the matching channel slot; the board will not train at 5600 MT/s if the population order is wrong.
No scheduled maintenance is required; the modules have no heat spreader, so keep case airflow clear of dust to maintain the 1.1V operating temperature envelope.
The CL46 latency at 5600 MT/s is the first bottleneck; bandwidth scales with the data rate, but the 46-cycle delay caps random-access throughput before thermal throttling can occur.
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