Thermal Grizzly KryoSheet TG-KS-29-25 29x25x.2mm graphene thermal pad
- KryoSheet graphene…
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Thermal Grizzly
A 25 × 25 × .2 mm graphene thermal pad that replaces paste on CPUs, GPUs and consoles with electrically conductive, non-drying performance
Size 25x25x0.2mm
Precrtane verzije postoje, ali nisu dostupne ovdje.
The Thermal Grizzly KryoSheet TG-KS-25-25 is a graphene thermal pad designed as a high-performance alternative to traditional thermal paste. It suits PC builders and console owners who want consistent heat transfer for CPUs, GPUs or consoles such as PS4, PS5 and Xbox without the mess or ageing of liquid compounds. The pad contains no liquid components so it cannot dry out over time.
KryoSheet pads are electrically conductive, so you must ensure no exposed traces, solder points or components on the die or surrounding PCB can be bridged by the pad. Verify the mounting pressure and surface flatness of your cooler or heatsink to guarantee full contact across the 25 by 25 millimetre area. Follow the manufacturer instructions exactly to avoid short-circuit damage.
This pad upgrades from standard thermal paste by eliminating pump-out, drying and re-application cycles while delivering higher conductivity than Carbonaut pads. The jump is worth it when you need long-term stability in high-heat scenarios such as overclocked CPUs, GPU hotspots or console APUs. It is not suited for builds that require a non-conductive interface or for gaps thicker than the .2 millimetre pad height.
| Brand | Thermal Grizzly |
|---|---|
| Model | TG-KS-25-25 |
| Part Number | TG-KS-25-25 |
| Features | KryoSheet graphene thermal pads are an excellent alternative for thermal pastes and have a conformable surface with very high thermal conductivity. Compared to Carbonaut pads, KryoSheet offers significantly higher thermal conductivity. |
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The package contains the 25x25x.2mm KryoSheet graphene thermal pad. No additional compounds or tools are required, but follow the included instructions carefully because the pad is electrically conductive.
Select the pad that matches the component's heat-spreader dimensions; this model is 25x25mm with a .2mm thickness, suitable for small dies or memory modules.
The optimised Z-direction molecular structure delivers consistent high thermal conductivity without drying out, providing reliable heat transfer for heavy workloads on CPUs, GPUs or consoles.
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