BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
- Rackmount
Prihvaćamo kriptovalute — tako kriptovalute koje posjedujete mogu kupiti pravi hardver.Plaćajte kriptovalutom, trošite je na pravi hardver. Besplatna osigurana dostava diljem svijeta iznad 399 $. Obični vanjski kartoni bez oznaka, otpremaju se iz Njemačke.Besplatna osigurana dostava iznad 399 $. Vaš je tečaj blokiran 30 minuta od otvaranja blagajne.Tečaj blokiran 30 minuta. Svaki je artikl zapečaćen, njegov serijski broj provjeren, i pokriven jamstvom od 24 mjeseca.Zapečaćen, jamstvo 24 mjeseca.
WMtec
Replacement motherboard for B50-70 and N50-70 laptops using LA-B091P board with Intel Xeon E5 i7 processor
This motherboard is designed as a direct replacement for Lenovo B50-70 and N50-70 models using the LA-B091P part number. It ships with an Intel Xeon E5 processor installed, identified as an I7 CPU variant alongside 3825 and 3558 references. The board suits repair technicians or owners restoring these specific notebook platforms.
The integrated design relies on the laptop's existing cooling assembly to manage heat from the Xeon E5 processor. Power consumption follows the original system specifications for the B50-70 and N50-70 chassis. No separate fan or radiator specifications are provided for this mainboard alone.
The board arrives with the Intel Xeon E5 I7 CPU already mounted, eliminating the need to purchase or install a separate processor. This simplifies the repair workflow for compatible B50-70 and N50-70 units. No additional accessories or software bundles are mentioned in the product data.
| CPU Type | Intel Xeon E5 |
|---|
Align the board mounting holes with the chassis standoffs, secure the screws, then reconnect the display cable and DC-in jack — the step most often missed is reseating the display cable fully into the connector.
The CMOS battery will eventually need replacement to retain BIOS settings, and the CPU heatsink compound should be refreshed if temperatures rise after extended use.
Thermal throttling typically appears first as the compact notebook cooling assembly reaches its heat-dissipation capacity during prolonged heavy workloads.
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