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Grey rectangular thermal pad, 85 by 45 mm, one millimetre thick

Bean

Bean Thermal Pad 12.8 W/mK 85x45x1mm

SKU CH-7761-1P9BD

A 12.8 W/mK non-conductive silicone pad sized 85×45×1 mm for filling gaps between CPUs, GPUs or LED modules and their heatsinks

  • High thermal conductivity of 12.8 W/mK moves heat away fast
  • Operates from -40 °C to 200 °C without melting or degrading
  • Non-conductive silicone prevents electrical shorts on sensitive components
  • Pads cut easily to fit gaps up to 85 mm by 45 mm
  • Replaces thermal paste on CPUs GPUs LEDs and power electronics

Purpose and audience

This 12.8 W/mK thermal pad replaces conventional grease between a processor or graphics chip and its heatsink. The silicone sheet targets builders and technicians who need a non-conductive, gap-filling interface for laptops, desktops or LED assemblies.

Compatibility checks

Verify that the mating surfaces can accommodate a 1 mm thick sheet and that the 85 mm by 45 mm footprint covers the die area; the pad can be trimmed with scissors to fit smaller components. Ensure the application does not exceed the stated operating range of minus 40 °C to 200 °C.

Thermals, noise and power

The pad conducts heat at 12.8 W/mK and contains no moving parts, so it adds zero acoustic noise and draws no electrical power. Its silicone construction remains stable across the full temperature span without melting, curing or losing compression.

Helstu kostir

  • High thermal conductivity of 12.8 W/mK moves heat away fast
  • Operates from -40 °C to 200 °C without melting or degrading
  • Non-conductive silicone prevents electrical shorts on sensitive components
  • Pads cut easily to fit gaps up to 85 mm by 45 mm
  • Replaces thermal paste on CPUs GPUs LEDs and power electronics

Tæknilýsing

Engin birt tæknilýsing fyrir þessa vöru enn.

Spurningar um þessa vöru

What comes in the package and is anything else needed to install the 85x45mm pad?

The package contains the thermal pad itself; no extra compound or tools are required because the pad can be cut to shape and placed directly between the component and heatsink.

Should I choose the 1mm thickness or the 0.5mm version for my laptop GPU?

The 1mm pad suits larger gaps typically found on laptop GPU or memory modules, while the thinner 0.5mm option is better for tight clearances on CPU dies or slim VRM areas.

What does the 12.8 W/mK rating actually deliver once the pad is fitted in a real machine?

It fills microscopic air gaps between the chip and cooler, lowering contact resistance so heat moves from the die to the heatsink more efficiently and component temperatures drop noticeably.

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