Priimame kriptovaliutą — taip monetos, kurias turite, gali nupirkti tikrą techniką.Mokėkite kriptovaliuta, išleiskite ją tikrai technikai. Nemokamas apdraustas pristatymas visame pasaulyje virš 399 $. Paprastos, be žymų siuntos dėžės, siunčiamos iš Vokietijos.Nemokamas apdraustas pristatymas virš 399 $. Jūsų kursas fiksuojamas 30 minučių, kai tik prasideda atsiskaitymas.Kursas fiksuojamas 30 minučių. Kiekvienas gaminys užplombuotas, jo serijos numeris patikrintas, ir jam taikoma 24 mėnesių garantija.Užplombuota, 24 mėnesių garantija.

Stebimos prekės Prisijungti
Rectangular grey thermal pad measuring 40 by 80 millimetres and 2 millimetres thick

Corn Electronics

Corn Electronics Tflex HD90000 Thermal Paste 40x80x2mm

SKU CH-YMC8-P2VZP

Silicone gap filler pad measuring 40 by 80 by 2 mm for CPU, GPU, memory and SSD cooling

Option 40*80*2mm

  • Low contact resistance through excellent surface wetting
  • Reduces board and component stress with low pressure deflection
  • Minimal outgassing keeps systems clean over time
  • Ultra-low D3-D20 under 20ppm for sensitive builds
  • RoHS and REACH compliant environmentally friendly formula

Product Identity

The Corn Electronics Tflex HD90000 is a silicone-based thermal gap filler measuring 40 by 80 by 2 millimetres. It targets builders and technicians who need a pre-cut pad for CPU, VGA, memory or SSD cooling where a compressible interface is preferred over liquid paste.

Compatibility Check

Verify that the component surface and the heatsink base can accommodate a 40 by 80 millimetre pad with a 2 millimetre uncompressed thickness. Confirm the mounting hardware applies enough pressure for the material to deflect and wet the surfaces without exceeding the design limits of the board or component.

Build And Use

The pad is engineered for low pressure versus deflection, minimising stress on boards and components during installation. Excellent surface wetting reduces contact resistance, while low outgassing and D3-D20 below 20 ppm support long-term stability. The formulation meets RoHS and REACH requirements for environmentally friendly use.

Privalumai

  • Low contact resistance through excellent surface wetting
  • Reduces board and component stress with low pressure deflection
  • Minimal outgassing keeps systems clean over time
  • Ultra-low D3-D20 under 20ppm for sensitive builds
  • RoHS and REACH compliant environmentally friendly formula

Specifikacijos

Šiai prekei specifikacijos dar nepaskelbtos.

Kiti šio modelio variantai

Dar 1 toje pačioje serijoje

Ta pati šeima, bet skiriasi atmintis, aušintuvas ar dažnis — palyginkite prieš apsispręsdami.

Klausimai apie šią prekę

Does the Corn Electronics Tflex HD90000 pack include any applicator tools or cleaning wipes?

The 40x80x2mm pad is supplied as a single piece; no spreader, syringe or cleaning wipes are included, so have isopropyl alcohol and a lint-free cloth ready for surface prep.

The listing shows only the 40x80x2mm size — how do I know if this thickness suits my GPU or SSD gap?

Measure the distance between the die and the cooler with feeler gauges; if the gap is close to 2 mm the pad will compress with low pressure, but larger gaps need a thicker sheet.

The model name includes 90000 — what does that figure tell me about real-world temperatures?

The 90000 designation is the manufacturer’s product code, not a thermal-conductivity rating; actual temperature drop depends on clamping pressure, surface flatness and the specific cooler used.

Taip pat šiame skyriuje

Kiti pirkėjai taip pat lygino

Ta pati lentyna, tas pats atsiskaitymas — aštuonios monetos ir 30 minučių fiksuotas kursas.