Prijímame kryptomeny — takže mince, ktoré držíte, môžete zameniť za skutočný hardvér.Plaťte v krypte, miňte ho na skutočný hardvér. Poistená doprava zadarmo po celom svete nad 399 $. Neutrálne kartóny bez potlače, odosielané z Nemecka.Poistená doprava zadarmo nad 399 $. Váš kurz je zablokovaný na 30 minút hneď po otvorení pokladne.Kurz zablokovaný na 30 minút. Každý produkt je zapečatený, jeho sériové číslo je overené a vzťahuje sa naň 24-mesačná záruka.Zapečatené, 24-mesačná záruka.

Sledované položky Prihlásiť sa
Rectangular grey thermal pad measuring 40 by 80 millimetres and 2 millimetres thick

Corn Electronics

Corn Electronics Tflex HD90000 Thermal Paste 40x80x2mm

SKU CH-YMC8-P2VZP

Silicone gap filler pad measuring 40 by 80 by 2 mm for CPU, GPU, memory and SSD cooling

Option 40*80*2mm

  • Low contact resistance through excellent surface wetting
  • Reduces board and component stress with low pressure deflection
  • Minimal outgassing keeps systems clean over time
  • Ultra-low D3-D20 under 20ppm for sensitive builds
  • RoHS and REACH compliant environmentally friendly formula

Product Identity

The Corn Electronics Tflex HD90000 is a silicone-based thermal gap filler measuring 40 by 80 by 2 millimetres. It targets builders and technicians who need a pre-cut pad for CPU, VGA, memory or SSD cooling where a compressible interface is preferred over liquid paste.

Compatibility Check

Verify that the component surface and the heatsink base can accommodate a 40 by 80 millimetre pad with a 2 millimetre uncompressed thickness. Confirm the mounting hardware applies enough pressure for the material to deflect and wet the surfaces without exceeding the design limits of the board or component.

Build And Use

The pad is engineered for low pressure versus deflection, minimising stress on boards and components during installation. Excellent surface wetting reduces contact resistance, while low outgassing and D3-D20 below 20 ppm support long-term stability. The formulation meets RoHS and REACH requirements for environmentally friendly use.

Prednosti

  • Low contact resistance through excellent surface wetting
  • Reduces board and component stress with low pressure deflection
  • Minimal outgassing keeps systems clean over time
  • Ultra-low D3-D20 under 20ppm for sensitive builds
  • RoHS and REACH compliant environmentally friendly formula

Špecifikácie

Pre tento produkt zatiaľ nie sú zverejnené žiadne špecifikácie.

Ďalšie verzie tohto modelu

Ďalších 1 v tomto rade

Rovnaký rad, iná pamäť, chladič alebo frekvencia — porovnajte pred rozhodnutím.

Otázky k tomuto produktu

Does the Corn Electronics Tflex HD90000 pack include any applicator tools or cleaning wipes?

The 40x80x2mm pad is supplied as a single piece; no spreader, syringe or cleaning wipes are included, so have isopropyl alcohol and a lint-free cloth ready for surface prep.

The listing shows only the 40x80x2mm size — how do I know if this thickness suits my GPU or SSD gap?

Measure the distance between the die and the cooler with feeler gauges; if the gap is close to 2 mm the pad will compress with low pressure, but larger gaps need a thicker sheet.

The model name includes 90000 — what does that figure tell me about real-world temperatures?

The 90000 designation is the manufacturer’s product code, not a thermal-conductivity rating; actual temperature drop depends on clamping pressure, surface flatness and the specific cooler used.

Aj v tomto oddelení

Zákazníci tiež porovnávali

Rovnaké oddelenie, rovnaká pokladňa — osem mien a kurz zablokovaný na 30 minút.