NEMIX RAM DDR5-5600 2TB (16x128GB) ECC RDIMM CL46 1.1V Supermicro H14SST-G memory upgrade
- 2TB (16 x 128GB)
- 288-Pin DDR5 RDIMM
Mēs pieņemam kriptovalūtu — lai tā, kas Jums pieder, varētu nopirkt īstu aparatūru.Maksājiet kriptovalūtā, iztērējiet to īstai aparatūrai. Bezmaksas apdrošināta piegāde visā pasaulē virs 399 $. Vienkāršas, nemarķētas kastes, sūtītas no Vācijas.Bezmaksas apdrošināta piegāde virs 399 $. Jūsu kurss tiek fiksēts uz 30 minūtēm, tiklīdz atveras kase.Kurss fiksēts uz 30 minūtēm. Katra prece ir aizzīmogota, tās sērijas numurs ir pārbaudīts, un uz to attiecas 24 mēnešu garantija.Aizzīmogots, 24 mēnešu garantija.
AMD
12-core server processor with 24 threads, 2.9 GHz base clock, 64 MB L3 cache and 128 PCIe 4.0 lanes for high-density workloads
The AMD EPYC 7272 is a 12-core, 24-thread CPU designed for Socket SP3 platforms. It operates at a base frequency of 2.9 GHz with a maximum boost of 3.2 GHz. The processor features 64 MB of L3 cache and 6 MB of L2 cache, built on 7 nm process technology. It supports 8-channel DDR4-3200 memory and provides 128 lanes of PCIe 4.0 connectivity. This OEM part is sold without a cooling device.
This processor fits virtualisation hosts, hyper-converged nodes and compute clusters that benefit from high core counts and wide memory bandwidth within a 120 W thermal envelope. The 8-channel memory architecture and 128 PCIe 4.0 lanes help reduce I/O bottlenecks in storage-heavy or GPU-accelerated deployments. Buyers who require higher per-core frequencies for lightly threaded applications or who need a processor with an included cooler should consider other options.
The processor installs exclusively into a Socket SP3 motherboard with appropriate BIOS support for the EPYC 7002 series. No other socket type will accept this chip. Verify platform qualification before purchase.
| Brand | AMD |
|---|---|
| Series | AMD EPYC 7002 |
| Name | EPYC 7272 |
| Model | 100-000000079 |
| CPU Socket Type | Socket SP3 |
| # of Cores | 12-Core |
| # of Threads | 24 |
| Operating Frequency | 2.9 GHz |
| Max Turbo Frequency | 3.2 GHz |
| L3 Cache | 64MB |
| 64-Bit Support | Yes |
| Manufacturing Tech | 7 nm |
| Integrated Memory Controller Speed | DDR4 3200 |
| Memory Channel | 8 Channel |
| Virtualization Technology Support | Yes |
| PCI Express Revision | 4.0 |
| Max # of PCI Express Lanes | 128 |
| Thermal Design Power | 120W |
| Cooling Device | Cooling device not included - Processor Only |
| Sūtījuma svars | 0.45 kg |
| Sūtījuma izmēri | 203 × 127 × 76 mm |
Align the gold triangle on the processor with the socket corner, lower the retention frame, then torque the captive screws in a cross pattern to the board-specified value; skipping the cross-pattern sequence is the common error that causes uneven contact.
The thermal interface material between the CPU lid and heatsink should be refreshed every two to three years; the processor itself has no user-replaceable parts and no moving components.
The 120 W thermal design power is reached first; the VRM and cooler must dissipate that heat continuously or the firmware will throttle clocks below the 3.2 GHz maximum turbo frequency.
Arī šajā sadaļā
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