NEMIX RAM 64GB DDR4 3200 4Rx4 1.2V 288-PIN ECC LRDIMM server RAM
- DDR4 3200 (PC4 2560…
- 22
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AMD
12-core server processor with 24 threads, 2.9 GHz base clock, 64 MB L3 cache and 128 PCIe 4.0 lanes for high-density workloads
The AMD EPYC 7272 is a 12-core, 24-thread CPU designed for Socket SP3 platforms. It operates at a base frequency of 2.9 GHz with a maximum boost of 3.2 GHz. The processor features 64 MB of L3 cache and 6 MB of L2 cache, built on 7 nm process technology. It supports 8-channel DDR4-3200 memory and provides 128 lanes of PCIe 4.0 connectivity. This OEM part is sold without a cooling device.
This processor fits virtualisation hosts, hyper-converged nodes and compute clusters that benefit from high core counts and wide memory bandwidth within a 120 W thermal envelope. The 8-channel memory architecture and 128 PCIe 4.0 lanes help reduce I/O bottlenecks in storage-heavy or GPU-accelerated deployments. Buyers who require higher per-core frequencies for lightly threaded applications or who need a processor with an included cooler should consider other options.
The processor installs exclusively into a Socket SP3 motherboard with appropriate BIOS support for the EPYC 7002 series. No other socket type will accept this chip. Verify platform qualification before purchase.
| Brand | AMD |
|---|---|
| Series | AMD EPYC 7002 |
| Name | EPYC 7272 |
| Model | 100-000000079 |
| CPU Socket Type | Socket SP3 |
| # of Cores | 12-Core |
| # of Threads | 24 |
| Operating Frequency | 2.9 GHz |
| Max Turbo Frequency | 3.2 GHz |
| L3 Cache | 64MB |
| 64-Bit Support | Yes |
| Manufacturing Tech | 7 nm |
| Integrated Memory Controller Speed | DDR4 3200 |
| Memory Channel | 8 Channel |
| Virtualization Technology Support | Yes |
| PCI Express Revision | 4.0 |
| Max # of PCI Express Lanes | 128 |
| Thermal Design Power | 120W |
| Cooling Device | Cooling device not included - Processor Only |
| Shipping weight | 0.45 kg |
| Package size | 203 × 127 × 76 mm |
Align the gold triangle on the processor with the socket corner, lower the retention frame, then torque the captive screws in a cross pattern to the board-specified value; skipping the cross-pattern sequence is the common error that causes uneven contact.
The thermal interface material between the CPU lid and heatsink should be refreshed every two to three years; the processor itself has no user-replaceable parts and no moving components.
The 120 W thermal design power is reached first; the VRM and cooler must dissipate that heat continuously or the firmware will throttle clocks below the 3.2 GHz maximum turbo frequency.
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