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ASUS PRIME B860-PLUS motherboard and Intel Ultra 5 245K CPU in retail box

ASUS

ASUS PRIME B860-PLUS + Ultra 5 245K Combo

SKU CH-CS5B-YS42E

A motherboard and CPU bundle with LGA 1851 socket, 20 Gbps USB, PCIe 5.0 slot, 2.5 Gb LAN and included Shin-Etsu thermal paste

  • CPU Socket TypeLGA 1851

model PRIME B860-PLUS

Skatīt vēl 3 konfigurācijas

+CPU +Ultra 5 245K

  • Ready-to-build combo includes motherboard, CPU and Shin-Etsu thermal paste
  • 125 W Ultra 5 245K delivers 24 MB L3 and 26 MB L2 cache
  • B860 board offers 80 A power stages on a 6-layer PCB for stable delivery
  • PCIe 5.0 x16 SafeSlot plus USB 20 Gbps and 2.5 Gb Ethernet for fast I/O
  • Shin-Etsu X-23-7868-2D paste rated at 6.2 W/m·k conductivity and 0.07 °C·cm²/W resistance

Combo Contents

This bundle pairs the ASUS PRIME B860-PLUS motherboard with the Intel Ultra 5 245K processor and a tube of Shin-Etsu X-23-7868-2D thermal grease. The board uses the Intel B860 chipset and an LGA 1851 socket to support second-generation Core Ultra CPUs. The 125W processor delivers 24MB of L3 cache and 26MB of L2 cache alongside integrated Intel Graphics.

Build Checklist

Verify that your chassis fits an ATX motherboard and that your power supply provides the 80A VRM phases required by the 125W CPU. The board runs DDR5 memory and offers a PCIe 5.0 x16 SafeSlot for graphics cards. Rear I/O includes a USB 20Gbps port and DisplayPort video output; the front-panel header supports a USB 5Gbps Type-C connector. Networking is handled by a 2.5Gb wired NIC.

Bundled Extras

The included Shin-Etsu paste has a thermal conductivity of 6.2 W/m.k and a thermal resistance of 0.07 °C·cm²/W. Its viscosity is rated at 100 Pa·s and the manufacturer suggests replacement every two years. On the software side, the motherboard adds UEFI BIOS with Q-LED troubleshooting lights, ASUS DriverHub for driver management, and AURA SYNC with second-generation addressable ARGB headers for lighting control.

Priekšrocības

  • Ready-to-build combo includes motherboard, CPU and Shin-Etsu thermal paste
  • 125 W Ultra 5 245K delivers 24 MB L3 and 26 MB L2 cache
  • B860 board offers 80 A power stages on a 6-layer PCB for stable delivery
  • PCIe 5.0 x16 SafeSlot plus USB 20 Gbps and 2.5 Gb Ethernet for fast I/O
  • Shin-Etsu X-23-7868-2D paste rated at 6.2 W/m·k conductivity and 0.07 °C·cm²/W resistance

Specifikācijas

BrandASUS
ModelPRIME B860-PLUS+Ultra 5 245K
CPU Socket TypeLGA 1851

Citas šī modeļa versijas

Vēl 5 šajā sērijā

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Jautājumi par šo preci

Does the combo include thermal paste for the CPU cooler?

Yes, Shin-Etsu X-23-7868-2D thermal grease is supplied with a thermal conductivity of 6.2 W/m.k and a suggested replacement cycle of 2 years.

What CPU socket and memory type does the motherboard use?

The board uses the LGA 1851 socket and supports DDR5 memory.

How many power phases and what PCIe generation does the primary slot provide?

The VRM has 12 phases rated at 80A each on a 6-layer PCB, and the top PCIe slot runs at 5.0 speed with SafeSlot reinforcement.

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