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ATX motherboard in box with CPU and thermal paste tube

ASUS

ASUS PRIME B860-PLUS & Ultra 7 265K Intel motherboard combo

SKU CH-6M7F-HWQ69

A motherboard and CPU bundle with LGA 1851 socket, DDR5 support, PCIe 5.0 slot, 2.5Gb Ethernet, USB 20Gbps port, and included Shin-Etsu thermal grease

  • CPU Socket TypeLGA 1851

model PRIME B860-PLUS

Skatīt vēl 3 konfigurācijas

+CPU +Ultra 7 265K

  • Ready-to-build combo includes CPU, board and thermal paste
  • 30 MB L3 and 36 MB L2 caches speed multi-thread workloads
  • 125 W 3 nm processor delivers high compute density
  • PCIe 5.0 x16 SafeSlot and USB 20 Gbps enable fast GPU and storage
  • 5 Gb LAN plus DDR5 support handles modern data throughput

ASUS PRIME B860-PLUS & Ultra 7 265K Combo

This bundle pairs an ASUS PRIME B860-PLUS ATX motherboard with an Intel Core Ultra 7 265K processor and Shin-Etsu X-23-7868-2D thermal grease. The board uses the LGA 1851 socket and supports DDR5 memory. It is built for users assembling a new Intel Core Ultra (2nd generation) system who want the CPU, board and paste in one package.

Thermals Noise and Power Draw

The CPU has a 125W base power rating and features 30MB L3 cache plus 36MB L2 cache. The motherboard delivers power through 8(80A) + 1(80A) + 1(80A) + 1(80A) + 1(80A) phases on a 6-layer PCB with Digi+ VRM control. Cooling relies on VRM heatsinks with thermal pads, an M.2 heatsink, and headers for 4-pin PWM/DC fans and a water pump.

Bundled Accessories and Software

The included Shin-Etsu thermal grease offers 6.2 W/m.k conductivity and 0.07 °C*cm^2/W resistance with a 100 Pa.s viscosity; the suggested replacement cycle is 2 years. Motherboard software includes UEFI BIOS, ASUS DriverHub for driver management, and AURA SYNC with 2nd generation addressable ARGB headers for lighting control. Hardware aids feature a pre-installed I/O backplate, PCIe 5.0 SafeSlot, and Q-LED troubleshooting lights.

Priekšrocības

  • Ready-to-build combo includes CPU, board and thermal paste
  • 30 MB L3 and 36 MB L2 caches speed multi-thread workloads
  • 125 W 3 nm processor delivers high compute density
  • PCIe 5.0 x16 SafeSlot and USB 20 Gbps enable fast GPU and storage
  • 5 Gb LAN plus DDR5 support handles modern data throughput

Specifikācijas

BrandASUS
ModelPRIME B860-PLUS+Ultra 7 265K
CPU Socket TypeLGA 1851

Citas šī modeļa versijas

Vēl 5 šajā sērijā

Viena saime, taču atšķirīga atmiņa, dzesētājs vai frekvence — salīdziniet, pirms izlemjat.

Jautājumi par šo preci

How do I install the LGA 1851 CPU into the socket, and what step do builders often miss?

Align the notches on the Intel Ultra 7 265K with the socket keys, lower it gently, and secure the retention lever. The step often missed is applying the included Shin-Etsu X-23-7868-2D thermal grease before mounting the cooler.

What maintenance will the Shin-Etsu X-23-7868-2D thermal paste need, and when?

The manufacturer suggests replacing the thermal grease every 2 years, with an official lifespan of 3 to 5 years, to maintain optimal heat transfer between the CPU and cooler.

What is the first limit reached under sustained heavy load with the 125W processor?

The 125W base power draw of the Intel Ultra 7 265K will test the 8+1+1+1+1 80A power stage design and VRM heatsink capacity before other board limits appear.

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