Bean Thermal Pad 12.8 W/mK 85x45x1.5mm

Product Identity

The Bean thermal pad measures 85 x 45 x 1.5 mm and delivers 12.8 W/mK thermal conductivity. It is a non-conductive silicone pad designed to transfer heat between components and heatsinks in laptops, GPUs, CPUs and LED coolers. The material remains stable from -40 °C to 200 °C without melting or degrading. It suits technicians and builders who need a clean, reusable alternative to thermal paste.

Capacity and Headroom

The 12.8 W/mK rating handles typical CPU and GPU heat loads while filling uneven gaps up to 1.5 mm thick. The pad can be cut to smaller shapes for VRAM, VRM or small IC packages. It will not bridge larger gaps or replace a mounting solution that requires more compression than the material provides. Builders needing higher conductivity or thicker pads must look elsewhere.

Thermals, Noise and Power

The pad adds no active cooling, so it produces zero noise and draws no power. Its insulation and fire-retardant properties prevent electrical shorts while maintaining thermal transfer at sustained high temperatures. Thermal resistance drops once the pad conforms to both surfaces under normal mounting pressure. Long-term stability is supported by anti-corrosion and anti-static characteristics.