BFKK
BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
- Rackmount
214,99 $
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Krājumā
G.SKILL
G.SKILL Flare X5 8GB DDR5 6000 CL30 desktop RAM F5-6000J3038F8GH1-FX5
Low-profile 8 GB DDR5 module running at 6000 MT/s with CL30 timing and AMD EXPO support for Ryzen platforms
- Capacity8GB
- Type288-Pin PC RAM
- SpeedDDR5 6000 (PC5 48000)
- CAS LatencyCL30
- Timing30-38-38-96
- Voltage1.35V
- Low-profile 33mm height fits compact builds
- AMD EXPO profile enables one-click overclocking on Ryzen platforms
- CL30 latency at 6000 MT/s delivers responsive performance
- 35V operation balances speed with efficiency
- Hand-screened ICs provide stability for gaming workloads
AMD Ryzen desktop memory
The Flare X5 module provides 8GB of DDR5 6000 capacity in a single 288-pin stick. It targets AMD 600 Series, AMD 800 Series, B650, B850, X670 and X870 platforms that support AMD EXPO profiles. The kit runs at CL30 with 1.35V and is explicitly not compatible with Intel Core Ultra 100/200 or Intel 800 series chipsets.
Sustained-load behaviour
Hand-screened IC chips and a 33mm low-profile heat spreader keep thermals stable during extended gaming or rendering sessions. Rated timings of 30-38-38-96 at 6000 MT/s are maintained without voltage scaling beyond 1.35V. The unbuffered, non-ECC design avoids registered latency overhead for consistent throughput.
Installation and common issues
The 33mm height clears most large CPU coolers in compact builds. Enable the AMD EXPO profile in BIOS to reach the advertised 6000 speed; leaving the board on defaults will drop the module to a lower JEDEC frequency. Do not install on Intel Core Ultra 100/200 or Intel 800 series platforms, as the kit will not post.
Priekšrocības
- Low-profile 33mm height fits compact builds
- AMD EXPO profile enables one-click overclocking on Ryzen platforms
- CL30 latency at 6000 MT/s delivers responsive performance
- 35V operation balances speed with efficiency
- Hand-screened ICs provide stability for gaming workloads
Specifikācijas
| Brand | G.SKILL |
|---|---|
| Series | Flare X5 |
| Model | F5-6000J3038F8GH1-FX5 |
| Capacity | 8GB |
| Type | 288-Pin PC RAM |
| Speed | DDR5 6000 (PC5 48000) |
| CAS Latency | CL30 |
| Timing | 30-38-38-96 |
| Voltage | 1.35V |
| ECC | No |
| Buffered/Registered | Unbuffered / Unregistered |
| BIOS/Performance Profile | AMD EXPO |
| Color | Black |
| Heat Spreader | Yes |
| Features | Flare X5 series is a low-profile DDR5 memory designed for high performance on compatible DDR5-enabled AMD platforms and supports AMD EXPO overclocking profiles for easy memory overclocking by simply enabling the EXPO profile in the BIOS with a compatible motherboard and processor. Featuring a 33mm low-profile height and built with hand-screened IC chips, the Flare X5 is an excellent choice for compact performance PC builds. • Overclock performance DDR5 memory for supported AMD platforms • 33mm Low-profile module height design • AMD EXPO Support |
| Recommend Use | AMD 600 Series / AMD 800 Series / AMD B650 / AMD B850 / AMD Ryzen Compatible / AMD X670 / AMD X870 / High Performance or Gaming Memory |
| LED Color | None |
| Sūtījuma svars | 0.09 kg |
| Sūtījuma izmēri | 222 × 146 × 13 mm |
Jautājumi par šo preci
How much heat does the 1.35V DDR5 6000 module produce during all-day use?
The kit runs at 1.35V with a 33mm low-profile heat spreader that dissipates heat from the hand-screened ICs, keeping temperatures in check during extended sessions.
What motherboard chipset and CPU combination do I need for this AMD EXPO kit to work?
A DDR5-enabled AMD platform such as B650, X670, B850 or X870 paired with a compatible Ryzen processor is required to enable the EXPO profile.
Can I install this 288-pin DDR5 6000 stick in a board that only supports DDR5 4800?
The module will down-clock to the board's maximum supported speed, but the CL30 30-38-38-96 timings and EXPO profile require a motherboard that validates DDR5 6000.
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