BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
- Rackmount
G.SKILL
Low-profile 8 GB DDR5 module running at 6000 MT/s with CL30 timing and AMD EXPO support for Ryzen platforms
The Flare X5 module provides 8GB of DDR5 6000 capacity in a single 288-pin stick. It targets AMD 600 Series, AMD 800 Series, B650, B850, X670 and X870 platforms that support AMD EXPO profiles. The kit runs at CL30 with 1.35V and is explicitly not compatible with Intel Core Ultra 100/200 or Intel 800 series chipsets.
Hand-screened IC chips and a 33mm low-profile heat spreader keep thermals stable during extended gaming or rendering sessions. Rated timings of 30-38-38-96 at 6000 MT/s are maintained without voltage scaling beyond 1.35V. The unbuffered, non-ECC design avoids registered latency overhead for consistent throughput.
The 33mm height clears most large CPU coolers in compact builds. Enable the AMD EXPO profile in BIOS to reach the advertised 6000 speed; leaving the board on defaults will drop the module to a lower JEDEC frequency. Do not install on Intel Core Ultra 100/200 or Intel 800 series platforms, as the kit will not post.
| Brand | G.SKILL |
|---|---|
| Series | Flare X5 |
| Model | F5-6000J3038F8GH1-FX5 |
| Capacity | 8GB |
| Type | 288-Pin PC RAM |
| Speed | DDR5 6000 (PC5 48000) |
| CAS Latency | CL30 |
| Timing | 30-38-38-96 |
| Voltage | 1.35V |
| ECC | No |
| Buffered/Registered | Unbuffered / Unregistered |
| BIOS/Performance Profile | AMD EXPO |
| Color | Black |
| Heat Spreader | Yes |
| Features | Flare X5 series is a low-profile DDR5 memory designed for high performance on compatible DDR5-enabled AMD platforms and supports AMD EXPO overclocking profiles for easy memory overclocking by simply enabling the EXPO profile in the BIOS with a compatible motherboard and processor. Featuring a 33mm low-profile height and built with hand-screened IC chips, the Flare X5 is an excellent choice for compact performance PC builds. • Overclock performance DDR5 memory for supported AMD platforms • 33mm Low-profile module height design • AMD EXPO Support |
| Recommend Use | AMD 600 Series / AMD 800 Series / AMD B650 / AMD B850 / AMD Ryzen Compatible / AMD X670 / AMD X870 / High Performance or Gaming Memory |
| LED Color | None |
| 出貨重量 | 0.09 kg |
| 包裝尺寸 | 222 × 146 × 13 mm |
The kit runs at 1.35V with a 33mm low-profile heat spreader that dissipates heat from the hand-screened ICs, keeping temperatures in check during extended sessions.
A DDR5-enabled AMD platform such as B650, X670, B850 or X870 paired with a compatible Ryzen processor is required to enable the EXPO profile.
The module will down-clock to the board's maximum supported speed, but the CL30 30-38-38-96 timings and EXPO profile require a motherboard that validates DDR5 6000.
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