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Uzraudzītās preces Pieteikties
Silver 2U rackmount server chassis with four rear-access nodes and twenty-four 2.5-inch drive bays

GIGABYTE

GIGABYTE H274-S60-AAW1 barebone server 2U 4-node 24-bay Gen5 NVMe/SATA/SAS-4

SKU CH-AQRS-9SWQE MPN H274-S60-AAW1

A 2U rackmount barebones system holding four dual-socket nodes with 24 hot-swap 2.5″ Gen5 NVMe/SATA/SAS-4 bays

  • Form Factor2U Rackmount
  • WorkloadAI/ML/HPC
  • CPU TypeIntel Xeon 6 Processors - Intel Xeon 6700-Series Processors
  • CPU SocketLGA 4710
  • Installed CPUNo CPU Installed
  • Max Processors8
  • 2U 4-node rear-access design fits four dual-socket servers in 2U
  • 24 hot-swap 2.5" bays support Gen5 NVMe, SATA and SAS-4 drives
  • 64 DDR5 slots per system deliver up to 8000 MT/s MRDIMM bandwidth
  • 8 LP PCIe Gen5 x16 plus 4 OCP NIC 3.0 slots enable high-speed add-in cards
  • Dual Intel Xeon 6 processors per node scale to 225 W TDP for AI and HPC workloads

High-density 2U 4-node server

The GIGABYTE H274-S60-AAW1 is a 2U rackmount barebones system housing four independent dual-processor nodes. Each node supports Intel Xeon 6 processors in LGA 4710 sockets with TDPs up to 225W. It targets AI, ML and HPC workloads requiring maximum compute density in a compact chassis.

Rear-access installation with CPU and memory care

All four nodes and 24 hot-swap drive bays are accessed from the rear, simplifying service in dense racks. No CPUs or memory are installed; each node requires two Xeon 6 processors and up to 16 DDR5 RDIMM or MCR DIMM modules across eight channels. Incorrect DIMM population or missing CPU power cables are the most common setup errors.

Verify rack depth, power and networking first

Confirm your rack accommodates a 2U rear-service chassis with sufficient airflow for four dual-socket nodes. Ensure the PDU can deliver enough current for up to eight 225W processors plus memory and drives. Check that 1GbE via four Intel I350-AM2 ports per system meets management needs and plan for any OCP 3.0 or PCIe Gen5 add-in cards required.

Priekšrocības

  • 2U 4-node rear-access design fits four dual-socket servers in 2U
  • 24 hot-swap 2.5" bays support Gen5 NVMe, SATA and SAS-4 drives
  • 64 DDR5 slots per system deliver up to 8000 MT/s MRDIMM bandwidth
  • 8 LP PCIe Gen5 x16 plus 4 OCP NIC 3.0 slots enable high-speed add-in cards
  • Dual Intel Xeon 6 processors per node scale to 225 W TDP for AI and HPC workloads

Specifikācijas

BrandGIGABYTE
ModelH274-S60-AAW1
Form Factor2U Rackmount
WorkloadAI/ML/HPC
CPU TypeIntel Xeon 6 Processors
- Intel Xeon 6700-Series Processors
- Intel Xeon 6500-Series Processors
CPU SocketLGA 4710
Installed CPUNo CPU Installed
Max Processors8
CPU FeaturesDual processor per node, TDP up to 225W
Memory Slots64 x 288Pin
Installed Memory SizeNo Memory Installed
Memory Type SupportedRDIMM: Up to 6400 MT/s
MRDIMM: Up to 8000 MT/s
Channel Supported8 Channel
RegisteredYes
Installed HDDNo Storage Installed
GPU/VPUAspeed AST2600
PCI Express8 x LP PCIe Gen5 x16 slots
4 x OCP NIC 3.0 PCIe Gen5 x16 slots
First LAN4 x Intel I350-AM2
Max. LAN Speed1 Gigabit
Hot-Swap Bays24 x 2.5" Gen5 NVMe/SATA/SAS-4
- (NVMe & SATA from CPU_1)
Buttons4 x Reset buttons
1 x CMC reset button
LEDs4 x Power buttons with LED
4 x ID buttons with LED
4 x System status LEDs
1 x CMC status LED
DisplayPort4 x Mini DisplayPorts
Rear USB8 x USB 3.2 Gen1 ports (Type-A)
RJ458
Other Ports4 x MLAN
Max. PowerDual 3000W 80 PLUS Titanium redundant power supply
Fans4 x 80x80x80mm (16,500rpm)
TemperatureOperating temperature: 10°C to 35°C
Non-operating temperature: -40°C to 60°C
HumidityOperating humidity: 8-80% (non-condensing)
Non-operating humidity: 20%-95% (non-condensing)
Dimensions2U 4-Node - Rear access
3.44" x 17.32" x 34.53"
Package Contents1 x H274-S60-AAW1
8 x CPU heatsinks
1 x Mini-DP to D-Sub cable
16 x Carriers
1 x 3-Section Rail kit
Sūtījuma svars30.00 kg
Sūtījuma izmēri1179 × 700 × 380 mm

Jautājumi par šo preci

How do I verify the system is operational after installing CPUs, memory and drives?

The Aspeed AST2600 BMC provides out-of-band management; use its web interface or IPMI to confirm all four nodes report healthy POST, sensor readings and drive presence across the 24 hot-swap bays.

What components are included and which must be purchased separately?

The barebones chassis includes the 2U enclosure, four node boards with LGA 4710 sockets, 64 DDR5 slots, 24 Gen5 NVMe/SATA/SAS-4 bays, eight LP PCIe Gen5 x16 slots, four OCP NIC 3.0 slots and four Intel I350-AM2 1 Gb/s LAN ports; CPUs, RDIMM or MRDIMM memory and storage drives are not installed.

Which memory speed should I choose between RDIMM at 6400 MT/s and MRDIMM at 8000 MT/s?

Select MRDIMM at 8000 MT/s for maximum throughput on memory-bound AI/ML/HPC workloads; choose RDIMM at 6400 MT/s when capacity per module or cost per gigabyte is the priority.

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