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GIGABYTE

GIGABYTE X870E AERO X3D WOOD AMD motherboard

SKU CH-GN51-N1GTS MPN X870E AERO X3D WOOD

ATX board for AM5 Ryzen 7000/8000/9000 CPUs with 16+2+2 power phases, four DDR5 slots up to 256 GB, PCIe 5.0 x16, four M.2 sockets, USB4 Type-C, WIFI7, Bluetooth 5.4 and dual 5 GbE LAN

  • CPU Socket TypeAM5
  • CPU TypeRyzen 7000 Series / Ryzen 8000 Series / Ryzen 9000 Series
  • ChipsetAMD X870E
  • Number of Memory Slots4x288pin (DDR5)
  • Memory StandardDDR5 5200
  • Maximum Memory Supported256GB
  • Ready for Ryzen 9000, 8000 and 7000 series CPUs
  • Digital twin 16+2+2 power phase with 8-layer PCB
  • Four DDR5 slots support up to 256 GB with AMD EXPO
  • One PCIe 5.0 x16 plus four M.2 slots for fast storage
  • Dual 5 GbE LAN, WIFI7 and Bluetooth 5.4 built in

Socket AM5 Platform

This ATX motherboard uses the AMD X870E chipset and AM5 socket to support Ryzen 7000, 8000 and 9000 series processors. Four DDR5 slots accept up to 256 GB of unbuffered non-ECC memory running at 5200 MT/s with AMD EXPO or Intel XMP profiles. A 16+2+2 digital twin power phase design on an eight-layer PCB delivers steady current to the CPU.

Upgrade Path and Value

Builders moving from an older AM4 system gain PCIe 5.0 graphics and storage lanes, dual 5 Gbps Ethernet, WIFI7 and Bluetooth 5.4 in one step. The jump is worth it when a new Ryzen 9000 or 7000 series CPU is paired with a PCIe 5.0 NVMe drive and high-speed DDR5 kit. Ryzen 8000 series processors limit the primary slot to PCIe 4.0 x8 or x4 and the CPU-attached M.2 to PCIe 4.0 speeds.

Interface Limits

The CPU-linked PCIe 5.0 x16 slot shares bandwidth with the chipset x16 slot; populating the second slot reduces the first to x8. One M.2 socket runs at PCIe 5.0 x4 with Ryzen 9000 and 7000 CPUs but drops to PCIe 4.0 with Ryzen 8000 chips. SATA RAID 0, 1, 5 and 10 are available for NVMe devices, though RAID 5 requires a Ryzen 9000 processor.

Priekšrocības

  • Ready for Ryzen 9000, 8000 and 7000 series CPUs
  • Digital twin 16+2+2 power phase with 8-layer PCB
  • Four DDR5 slots support up to 256 GB with AMD EXPO
  • One PCIe 5.0 x16 plus four M.2 slots for fast storage
  • Dual 5 GbE LAN, WIFI7 and Bluetooth 5.4 built in

Specifikācijas

BrandGIGABYTE
ModelX870E AERO X3D WOOD
CPU Socket TypeAM5
CPU TypeRyzen 7000 Series / Ryzen 8000 Series / Ryzen 9000 Series
ChipsetAMD X870E
Number of Memory Slots4x288pin (DDR5)
Memory StandardDDR5 5200
Maximum Memory Supported256GB
Channel SupportedDual Channel
Memory Performance ProfileAMD EXPO / Intel XMP
ECC SupportedNon-ECC
Buffer SupportedUn-buffered
PCI Express 5.0 x161 x PCI Express x16 slot (PCIEX16), integrated in the CPU:
AMD Ryzen 9000/7000 Series Processors support PCIe 5.0 x16 mode
AMD Ryzen 8000 Series-Phoenix 1 Processors support PCIe 4.0 x8 mode
AMD Ryzen 8000 Series-Phoenix 2 Processors support PCIe 4.0 x4 mode
* The PCIEX8 slot shares bandwidth with the PCIEX16 slot. When the PCIEX8 slot is populated, the PCIEX16 slot operates at up to x8 mode.
* The PCIEX16 and PCIEX8 slots can only support a graphics card or an NVMe SSD. If only one graphics card is to be installed, be sure to install it in the PCIEX16 slot.
1 x PCI Express x16 slot
PCI Express x16Chipset:
- 1 x PCI Express x16 slot, supporting PCIe 4.0 and running at x4 (PCIEX4)
Serial ATA (SATA)4 x SATA 6Gb/s
M.21 x M.2 connector (M2A_CPU), integrated in the CPU, supporting Socket 3, M key, type 2580/2280 SSDs:
AMD Ryzen 9000/7000 Series Processors support PCIe 5.0 x4/x2 SSDs
AMD Ryzen 8000 Series-Phoenix 1 Processors support PCIe 4.0 x4/x2 SSDs
AMD Ryzen 8000 Series-Phoenix 2 Processors support PCIe 4.0 x4/x2 SSDs
1 x M.2 connector (M2B_CPU), integrated in the CPU, supporting Socket 3, M key, type 22110/2280 SSDs:
AMD Ryzen 9000/7000 Series Processors support PCIe 5.0 x4/x2 SSDs
* The M2B_CPU connector shares bandwidth with the ASMedia USB4 controller. When a device is installed in theM2B_C
SATA RAIDRAID 0, RAID 1, RAID 5, and RAID 10 support for NVMe SSD storage devices
* RAID 5 is only available on AMD Ryzen 9000 Series Processors.
Audio ChipsetRealtek ALC1220
Audio Channels7.1 Channels
Max LAN Speed2 x 5Gbps
Wireless LANWi-Fi 802.11 be
BluetoothBLUETOOTH 5.4
Back I/O Ports1 x Q-Flash Plus button
1 x Clear CMOS button
1 x power button
1 x reset button
1 x HDMI port (Note)
2 x USB4 USB Type-C ports (DisplayPorts (Note))
1 x USB Type-C port, with USB 3.2 Gen 2x2 support
5 x USB 3.2 Gen 2 Type-A ports (red)
3 x USB 3.2 Gen 1 ports
2 x RJ-45 ports
2 x antenna connectors (2T2R)
2 x audio jacks
1 x optical S/PDIF Out connector
Onboard USB1 x USB Type-C header, with USB 3.2 Gen 2x2 support
2 x USB 3.2 Gen 1 headers
2 x USB 2.0/1.1 headers
Other Connectors1 x CPU fan header
1 x CPU fan/water cooling pump header
4 x system fan headers
2 x system fan/water cooling pump headers
3 x addressable RGB Gen2 LED strip headers
1 x RGB LED strip header
4 x M.2 Socket 3 connectors
4 x SATA 6Gb/s connectors
1 x front panel header
1 x front panel audio header
1 x noise detection header
1 x Trusted Platform Module header (For the GC-TPM2.0 SPI V2 module only)
1 x HDMI port (Note)
1 x reset jumper
1 x Clear CMOS jumper
2 x temperature sensor headers
Form FactorATX
Dimensions (W x L)12.0" x 9.6"
Power Pin1 x 24-pin ATX main power connector
2 x 8-pin ATX 12V power connectors
BIOS Feature1 x 256 Mbit flash
Use of licensed AMI UEFI BIOS
PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0
Windows 11Supported
Sūtījuma svars3.15 kg
Sūtījuma izmēri335 × 305 × 89 mm

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Jautājumi par šo preci

What case clearance and form factor does the X870E AERO X3D WOOD require?

The board uses the ATX form factor and fits standard ATX cases with the matching mounting hole pattern and I/O shield cutout.

How do I install an M.2 SSD on this motherboard, and what step is often missed?

Use the M.2 EZ-Latch Click & Plus mechanism to secure the drive without screws; the step often missed is lifting the latch fully before sliding the SSD in at the correct angle.

Which component on this motherboard will need replacement over time?

The BIOS firmware chip can be updated via Q-Flash Auto Scan, but the physical chip itself is not user-replaceable; no other field-replaceable maintenance parts are specified.

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