Lirealar
Lirealar TF8 Thermal Paste 1.2g 13.8 W/mK
Carbon-based thermal compound rated at 13.8 W/mK for CPU and GPU heat transfer
- Volume / Net Weight1.2g
- Thermal Conductivity13.8 W/mK,
- Long Term Operating Temperature-220~380°C
- SpecificationsColor:Gray Thermal resistance:<0.01(°C-CM²/W) Density:2.9(25
- FeaturesHigh Thermal Conductivity 13.8 W/mK Non-Elecnical Conducive
Type Thermal Paste
- Thermal Pad
- Thermal Paste
Pārsvītrotās versijas pastāv, taču šeit nav pieejamas.
- High thermal conductivity of 13.8 W/mK for efficient CPU and GPU heat dissipation
- Non-electrically conductive carbon formula eliminates short-circuit risk on components
- Non-corrosive, non-curing and non-toxic composition safe for long-term use
- Stable performance retained for at least six years without re-application
- Easy-apply consistency suits beginners and avoids voids between die and cooler
High-conductivity carbon paste
Lirealar TF8 is a 1.2 g syringe of carbon-based thermal compound rated at 13.8 W/mK. The grey paste is non-electrically-conductive, non-corrosive and non-curing, so it poses no short-circuit risk and remains stable for at least six years. It is intended for CPU, GPU and general heatsink interfaces on desktops and laptops.
Practical temperature and resistance limits
The compound is specified for continuous operation from -220 °C to 380 °C, covering every conventional air- or liquid-cooled scenario. Thermal resistance is quoted below 0.01 °C·cm²/W at a density of 2.9 g/cm³ measured at 25 °C, indicating very thin bond-line performance when applied correctly.
Replaces standard silicone or metal greases
Users moving from basic silicone paste or electrically conductive metal compounds gain higher conductivity without the short-circuit hazard. The upgrade is worthwhile when lower junction temperatures or longer service intervals matter, but it is not for builders who need larger volumes for multiple sockets or industrial rework stations.
Priekšrocības
- High thermal conductivity of 13.8 W/mK for efficient CPU and GPU heat dissipation
- Non-electrically conductive carbon formula eliminates short-circuit risk on components
- Non-corrosive, non-curing and non-toxic composition safe for long-term use
- Stable performance retained for at least six years without re-application
- Easy-apply consistency suits beginners and avoids voids between die and cooler
Specifikācijas
| Series | Thermal Paste |
|---|---|
| Model | TF8 Thermal Compound Paste |
| Volume / Net Weight | 1.2g |
| Thermal Conductivity | 13.8 W/mK, |
| Long Term Operating Temperature | -220~380°C |
| Specifications | Color:Gray Thermal resistance:<0.01(°C-CM²/W) Density:2.9(25°C) Operating temperature:-220~380°C Electrical conductivity:NO Harmless:YES Content: 12.8g |
| Features | High Thermal Conductivity 13.8 W/mK Non-Elecnical Conducive Non-Corrosive, Non-Curing & Non-Toxi lnsulation does not conduct electricity and is safe for use It will last At least for 6 years |
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Jautājumi par šo preci
How much paste does the 1.2 g syringe provide for a typical CPU application?
The 1.2 g syringe contains enough compound for several standard CPU installations, with a small amount remaining for future touch-ups.
What does the 13.8 W/mK conductivity figure mean once the paste is between a CPU and cooler?
It indicates very efficient heat transfer across the interface, helping lower core temperatures under load compared to standard pastes.
Is the TF8 electrically conductive, and does that affect which coolers or sockets I can use it with?
No, the carbon-based formula is non-electrically conductive, so it poses no short-circuit risk on exposed CPU pins or GPU components.
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