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Two small grey syringes of carbon thermal paste with a plastic spreader tool

Lirealar

Lirealar TF4 Carbon Thermal Paste 9.5 W/mK 1g 2pcs with Tool

SKU CH-NED0-43E7Y MPN TF4

Carbon-based compound rated at 9.5 W/mK for CPU and GPU cooling, non-conductive and non-corrosive, supplied as two 1 g syringes with application tool

  • Volume / Net Weight1g 2Pcs
  • Thermal Conductivity9.5 W/mK,
  • Long Term Operating Temperature-50~240°C
  • SpecificationsColor:Gray Thermal resistance:<0.0068(°C-CM²/W) Density:2.7(
  • FeaturesHigh Thermal Conductivity 9.5 W/mK Non-Elecnical Conducive N

Type Thermal Paste

Model TF4

Pārsvītrotās versijas pastāv, taču šeit nav pieejamas.

Specification 1g

Skatīt vēl 1 konfigurācijas
  • High thermal conductivity 9.5 W/mK moves heat efficiently from CPU or GPU
  • Non-electrically conductive carbon formula eliminates short-circuit risk on sensitive components
  • Long-term stability rated for at least six years without drying or curing
  • Wide operating range from -50 °C to 240 °C suits extreme cooling setups
  • Two 1 g syringes with application tool included for convenient, repeatable use

High-Conductivity Carbon Paste

Lirealar TF4 is a carbon-based thermal compound rated at 9.5 W/mK, supplied as two 1 g syringes with an application tool. It is formulated for desktop and laptop CPUs, GPUs and LED coolers where efficient heat transfer is required. The grey paste is non-electrically conductive, non-corrosive and non-curing, so it remains stable across a -50 °C to 240 °C operating range.

Suited for Standard Replacements

This twin-pack suits builders refreshing paste on a single processor or graphics card, or keeping a spare syringe for future maintenance. The non-conductive formula removes the risk of short circuits if excess spreads beyond the die. Users needing larger volumes for multiple builds, or compounds with higher conductivity ratings for extreme overclocking, should look at alternative products.

Tool Simplifies Application

The included spreader tool helps create an even layer and reduces air voids between the die and cooler base. Because the compound does not cure or dry out, the initial application remains effective for at least six years without re-application. Electrical insulation and non-toxic composition add safety during handling and long-term use.

Priekšrocības

  • High thermal conductivity 9.5 W/mK moves heat efficiently from CPU or GPU
  • Non-electrically conductive carbon formula eliminates short-circuit risk on sensitive components
  • Long-term stability rated for at least six years without drying or curing
  • Wide operating range from -50 °C to 240 °C suits extreme cooling setups
  • Two 1 g syringes with application tool included for convenient, repeatable use

Specifikācijas

SeriesThermal Paste
ModelTF4 Thermal Compound Paste
Volume / Net Weight1g 2Pcs
Thermal Conductivity9.5 W/mK,
Long Term Operating Temperature-50~240°C
SpecificationsColor:Gray Thermal resistance:<0.0068(°C-CM²/W) Density:2.7(25°C) Operating temperature:-50~240°C Electrical conductivity:NO Harmless:YES Content: 1g 2Pcs
FeaturesHigh Thermal Conductivity 9.5 W/mK Non-Elecnical Conducive Non-Corrosive, Non-Curing & Non-Toxi lnsulation does not conduct electricity and is safe for use It will last At least for 6 years

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Jautājumi par šo preci

What CPU cooler or heatsink do I need to pair with the TF4 paste?

The TF4 paste works with any standard desktop or laptop CPU cooler and GPU heatsink; it fills microscopic gaps between the die and the cooler base to transfer heat at 9.5 W/mK.

Can I use this paste on an older processor that previously had metal-based compound?

Yes, the carbon-based TF4 is non-electrically conductive and non-corrosive, so it will not cause short circuits or degrade older CPU lids or GPU dies.

How can I verify the paste is performing correctly after application?

Monitor CPU or GPU temperatures under load; the paste operates from -50 to 240 °C with thermal resistance below 0.0068 °C·cm²/W and remains stable for at least six years.

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