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MAXSUN DIY-APE H610-KING back-connector motherboard with full metal armor and rear I/O cluster

MAXSUN

MAXSUN DIY-APE H610-KING Back-Connector YTX Intel motherboard

SKU CH-6BRZ-SSBS0

Intel H610 back-connector YTX board for LGA 1700 12th and 13th Gen CPUs with DDR4 3200 dual-channel support up to 64 GB, PCIe 4.0 x16, four SATA, dual M.2 with heatsinks.

  • CPU Socket TypeLGA 1700
  • CPU Typebuffer_43521
  • ChipsetIntel H610
  • Number of Memory Slots2x288pin (DDR4)
  • Memory StandardDDR4 3200
  • Maximum Memory Supported64GB
  • Back-plug interface simplifies cable routing in compatible YTX cases
  • Full-cover armour spreads heat across the board for steadier operation
  • Dual DDR4 slots reach 64 GB at 3200 MT/s for responsive multitasking
  • Two M.2 slots include a 22110 length for high-capacity storage
  • Wi-Fi 6E and Bluetooth 5.3 ready via CNVi module for modern wireless connectivity

Hidden-Connector YTX Board

The MAXSUN DIY-APE H610-KING uses an LGA 1700 socket for Intel 12th and 13th generation processors with an H610 chipset. Its back-plug layout routes power, data and front-panel headers to the rear of the PCB for cleaner cable runs inside compatible YTX chassis. Two 288-pin slots support DDR4 dual-channel memory up to 64 GB at 3200 MT/s.

PCIe 4.0 and Storage Limits

A single PCI Express 4.0 x16 slot handles the graphics card at 4.0 speeds. Four SATA 6 Gb/s ports and two M.2 sockets (one 22110 and one 2280, both PCIe 3.0 x4) provide drive expansion. The board also includes a CNVi slot for a Wi-Fi 6E module with Bluetooth 5.3. Rear I/O supplies one RJ45 port, DP and HDMI video, one USB-C 10 Gbps, one USB 5 Gbps, four USB 2.0 and three audio jacks.

YTX Chassis Required

Installation is straightforward only in cases designed for back-mounted motherboards; standard ATX standoffs will not align. The full-cover armor and dual M.2 heatsinks add bulk, so verify clearance before mounting. An external BIOS reset button simplifies recovery if memory training fails. Remember the 130 W power-phase rating when choosing a CPU cooler and power supply.

Priekšrocības

  • Back-plug interface simplifies cable routing in compatible YTX cases
  • Full-cover armour spreads heat across the board for steadier operation
  • Dual DDR4 slots reach 64 GB at 3200 MT/s for responsive multitasking
  • Two M.2 slots include a 22110 length for high-capacity storage
  • Wi-Fi 6E and Bluetooth 5.3 ready via CNVi module for modern wireless connectivity

Specifikācijas

BrandMAXSUN
ModelDIY-APE H610-KING
CPU Socket TypeLGA 1700
CPU Typebuffer_43521
ChipsetIntel H610
Number of Memory Slots2x288pin (DDR4)
Memory StandardDDR4 3200
Maximum Memory Supported64GB
Channel SupportedDual Channel
PCI Express 4.0 x161 x PCI Express 4.0 x16
Serial ATA (SATA)4 x SATA 6Gb/s
M.22 x M.2
Back I/O PortsRJ45 network card 1
Video output port DP+HDMI
WiFi reserved CNVi
USB-C 1(USB2.0)
audio 3 holes
BIOS reset yes (external)
USB-5G 4
USB-2.0 4

Jautājumi par šo preci

Should I choose the 22110 M.2 slot or the 2280 slot for my main drive?

Use the 22110 slot for the primary SSD if your drive is that length; the 2280 slot works for standard drives and both run at PCIe 3.0 x4 speeds.

What does the 130 W power rating mean for my CPU choice?

The 130 W rating covers the 4+1+1 phase VRM, so it handles 12th and 13th Gen LGA1700 processors within that thermal envelope.

Will the USB-C port on the rear I/O run at 10 Gbps or fall back to USB 2.0?

The rear USB-C is specified at 10 Gbps, while the front-panel USB-C header is limited to USB 2.0 speeds.

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