BFKK
BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
- Rackmount
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Krājumā
SAMSUNG
Samsung 8GB DDR4 3200 CL22 1Rx8 260-Pin SODIMM M471A1K43DB1-CWE
8 GB DDR4 SODIMM running at 3200 MHz with CL22 latency, 1.2 V operation and Samsung 1Rx8 module M471A1K43DB1-CWE
- Capacity8GB
- Type260-Pin DDR4 SO-DIMM
- SpeedDDR4 3200 (PC4 25600)
- CAS LatencyCL22
- Voltage1.20V
- ECCNo
- 8 GB capacity expands multitasking headroom for everyday workloads
- DDR4 3200 speed delivers 25600 MT/s bandwidth for responsive performance
- CL22 latency at 1.20 V balances quick access with low power draw
- 260-pin SODIMM form factor fits standard laptop memory slots
- Samsung 1Rx8 chip layout (1G x 8) x 8 ensures reliable single-rank operation
Samsung 8GB DDR4 3200 SODIMM
This 8GB DDR4 3200 module uses the 260-pin SO-DIMM form factor for laptop memory upgrades. It runs at 1.20V with CL22 latency and an unbuffered, non-ECC design. The Rev D component layout uses eight 1G x 8 chips in a single-rank configuration. Buyers needing ECC error correction or registered buffering should choose a different module.
Installation ease and common issues
The module inserts into a standard 260-pin DDR4 SO-DIMM slot at a shallow angle before clicking into the retention clips. No heat spreader is fitted, so the low profile clears tight chassis spaces. A frequent error is mixing this CL22 stick with faster CL-timed modules, which forces the system to run at the slowest common timings. Another issue occurs when the laptop BIOS does not automatically select the 3200 speed, leaving the memory at a lower JEDEC frequency.
Compatibility checks before ordering
Verify that the laptop accepts DDR4 SO-DIMM memory and has a free 260-pin slot. Confirm the platform supports 1.20V operation and can address an 8GB single-rank module. Check the manufacturer’s qualified-vendor list or manual for the exact part number M471A1K43DB1-CWE to avoid BIOS incompatibilities. Ensure the maximum supported capacity per slot is not lower than 8GB.
Priekšrocības
- 8 GB capacity expands multitasking headroom for everyday workloads
- DDR4 3200 speed delivers 25600 MT/s bandwidth for responsive performance
- CL22 latency at 1.20 V balances quick access with low power draw
- 260-pin SODIMM form factor fits standard laptop memory slots
- Samsung 1Rx8 chip layout (1G x 8) x 8 ensures reliable single-rank operation
Specifikācijas
| Brand | SAMSUNG |
|---|---|
| Capacity | 8GB |
| Type | 260-Pin DDR4 SO-DIMM |
| Speed | DDR4 3200 (PC4 25600) |
| CAS Latency | CL22 |
| Voltage | 1.20V |
| ECC | No |
| Buffered/Registered | Unbuffered / Unregistered |
| Heat Spreader | No |
Jautājumi par šo preci
How can I confirm the module is running at 3200 MHz with CL22 after installation?
Open Task Manager or CPU-Z and check the memory tab; it should report 3200 MT/s and a CAS latency of 22.
What comes in the box and is anything else required for a laptop upgrade?
The box contains one 8 GB 260-pin DDR4 SODIMM; no extra parts are needed if the laptop has a free slot.
Should I choose the 1Rx8 version or look for a different rank configuration?
The 1Rx8 layout uses eight 1 Gbit x 8 chips and is the standard density for 8 GB DDR4 SODIMMs.
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