Mēs pieņemam kriptovalūtu — lai tā, kas Jums pieder, varētu nopirkt īstu aparatūru.Maksājiet kriptovalūtā, iztērējiet to īstai aparatūrai. Bezmaksas apdrošināta piegāde visā pasaulē virs 399 $. Vienkāršas, nemarķētas kastes, sūtītas no Vācijas.Bezmaksas apdrošināta piegāde virs 399 $. Jūsu kurss tiek fiksēts uz 30 minūtēm, tiklīdz atveras kase.Kurss fiksēts uz 30 minūtēm. Katra prece ir aizzīmogota, tās sērijas numurs ir pārbaudīts, un uz to attiecas 24 mēnešu garantija.Aizzīmogots, 24 mēnešu garantija.

Uzraudzītās preces Pieteikties
Green rectangular EATX server motherboard with dual LGA 3647 sockets and silver heatsinks

Supermicro

Supermicro MBD-X11DPI-NT-B Xeon Dual Socket S3647 C622 server motherboard

SKU CH-WW3Q-GWK9M MPN MBD-X11DPI-NT-B

Dual-socket Xeon server board with Intel C622 chipset in EATX form factor

  • Dual Xeon S3647 sockets scale multi-threaded workloads
  • Intel C622 chipset manages 12 PCI Express lanes
  • EATX form factor fits 11 drive bays
  • Bulk packaging reduces per-unit handling cost
  • First listed February 2018 for proven platform maturity

Dual Xeon server foundation

The Supermicro MBD-X11DPI-NT-B is an EATX motherboard built for dual Intel Xeon processors using the S3647 socket and C622 chipset. It targets system integrators and IT departments assembling high-density compute nodes or storage servers. Buyers needing a single-socket workstation board or consumer-grade features should look elsewhere.

Sustained multi-socket throughput

With two sockets populated the platform delivers continuous memory bandwidth and PCI Express lane availability for parallel workloads such as virtualisation clusters or database engines. Thermal design expects server chassis airflow rather than desktop cooling, so open-bench testing will not reflect real-world stability.

Bulk-pack installation notes

The board ships in bulk packaging without retail accessories, so installers must source mounting hardware, I/O shields and cable sets separately. EATX dimensions require a compatible chassis with proper standoff alignment; forcing the board into an undersized case risks PCB stress and short circuits.

Priekšrocības

  • Dual Xeon S3647 sockets scale multi-threaded workloads
  • Intel C622 chipset manages 12 PCI Express lanes
  • EATX form factor fits 11 drive bays
  • Bulk packaging reduces per-unit handling cost
  • First listed February 2018 for proven platform maturity

Specifikācijas

Šai precei pagaidām nav publicētu specifikāciju.

Arī šajā sadaļā

Klienti arī salīdzināja

Tas pats plaukts, tā pati kase — astoņas kriptovalūtas un kursa fiksēšana uz 30 minūtēm.