Mēs pieņemam kriptovalūtu — lai tā, kas Jums pieder, varētu nopirkt īstu aparatūru.Maksājiet kriptovalūtā, iztērējiet to īstai aparatūrai. Bezmaksas apdrošināta piegāde visā pasaulē virs 399 $. Vienkāršas, nemarķētas kastes, sūtītas no Vācijas.Bezmaksas apdrošināta piegāde virs 399 $. Jūsu kurss tiek fiksēts uz 30 minūtēm, tiklīdz atveras kase.Kurss fiksēts uz 30 minūtēm. Katra prece ir aizzīmogota, tās sērijas numurs ir pārbaudīts, un uz to attiecas 24 mēnešu garantija.Aizzīmogots, 24 mēnešu garantija.

Uzraudzītās preces Pieteikties

Supermicro

Supermicro MBD-X11DPI-NT-O dual Xeon LGA 3647 server motherboard

SKU CH-CYVT-4E1NT MPN MBD-X11DPI-NT-O

Dual-socket server board for 2nd Gen Intel Xeon Scalable CPUs with C622 chipset, 16 DDR4 DIMM slots up to 2 TB, 14 SATA ports, four PCIe 3.0 x16 and two x8 slots, plus dual 10GBase-T LAN

  • CPU Socket TypeDual LGA 3647
  • CPU TypeSupports 2nd Gen Intel Xeon Scalable Processors and Intel Xe
  • North BridgeIntel C622
  • DDR4 Standard2666 / 2400 / 2133 MHz ECC DDR4 RDIMM, LRDIMM
  • Maximum Memory SupportedUp to 2TB 3DS ECC RDIMM, DDR4-2666 MHz; Up to 2TB 3DS ECC LR
  • PCI Express 3.0 x164

Option Dual LAN with 10GBase-T

  • Dual Xeon Scalable support for high-density compute
  • 16 DDR4 slots enable up to 2TB ECC memory
  • 14 SATA 6Gb/s ports with RAID 0/1/5/10
  • Dual 10GBase-T LAN via Intel X722 and X557
  • 4 PCIe 3.0 x16 plus 2 x8 slots for expansion

Dual LGA 3647 server board for high-density compute

The Supermicro MBD-X11DPI-NT-O is a dual-socket Extended ATX motherboard built for Intel Xeon Scalable processors in the LGA 3647 package. It targets builders assembling multi-socket servers that need large memory capacity and abundant storage connectivity in a single node. The board supports CPU TDPs up to 205 W and two UPI links at 10.4 GT/s for inter-socket bandwidth.

Sixteen DDR4 slots scale to 2 TB with 3DS modules

Memory capacity is the decisive spec: sixteen DIMM slots accept ECC RDIMM or LRDIMM at 2666, 2400 or 2133 MHz, reaching 2 TB when 3DS parts are populated. Standard RDIMMs without 3DS stacking will not reach the maximum stated capacity, so buyers planning the full 2 TB must source 3DS-rated modules.

E-ATX layout demands a compatible chassis

The Extended ATX form factor requires a server case with matching mounting holes and sufficient clearance for the dual-socket keep-out zone. Fourteen SATA 6.0 Gb/s ports and two internal NVMe x4 connectors create dense cable routing; installers should verify backplane or drive-bay cabling reaches all headers before finalising the build.

Priekšrocības

  • Dual Xeon Scalable support for high-density compute
  • 16 DDR4 slots enable up to 2TB ECC memory
  • 14 SATA 6Gb/s ports with RAID 0/1/5/10
  • Dual 10GBase-T LAN via Intel X722 and X557
  • 4 PCIe 3.0 x16 plus 2 x8 slots for expansion

Specifikācijas

BrandSUPERMICRO
ModelMBD-X11DPI-NT-O
CPU Socket TypeDual LGA 3647
CPU TypeSupports 2nd Gen Intel Xeon Scalable Processors and Intel Xeon Scalable Processors
North BridgeIntel C622
DDR4 Standard2666 / 2400 / 2133 MHz ECC DDR4 RDIMM, LRDIMM
Maximum Memory SupportedUp to 2TB 3DS ECC RDIMM, DDR4-2666 MHz; Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
PCI Express 3.0 x164
PCI Express x82 x PCI-E 3.0 x8
SATA14 x SATA 6.0Gb/s
SATA RAID0/1/5/10
Onboard Video ChipsetAspeed AST2500
Number of LANDual LAN with 10GBase-T with Intel X722 + X557
Max LAN Speed2 x 1Gbps
COM1
S-Video1 x VGA port
USB 1.1/2.02 x USB 2.0
USB 3.02 x USB 3.0
FeaturesIntel Xeon Scalable Processors, Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel C622
Up to 2TB 3DS ECC RDIMM, DDR4-2666 MHz; Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
4 x PCI-E 3.0 x16, 2 x PCI-E 3.0 x8
M.2 Interface: PCI-E 3.0 x4
M.2 Form Factor: 2260, 2280, 22110
M.2 Key: M-Key,
2 x PCI-E 3.0 NVMe x4 Internal Port(s)
1 x VGA port
Intel C622 controller for 14 SATA3 (6 Gbps) ports; RAID 0, 1, 5, 10
Dual LAN with 10GBase-T with Intel X722 + X557
Form FactorExtended ATX
Dimensions (W x L)12.0" x 13.0"
Sūtījuma svars2.04 kg
Sūtījuma izmēri429 × 338 × 89 mm

Citas šī modeļa versijas

Vēl 1 šajā sērijā

Viena saime, taču atšķirīga atmiņa, dzesētājs vai frekvence — salīdziniet, pirms izlemjat.

Jautājumi par šo preci

How much memory can the board actually address once populated with 3DS modules?

The board supports up to 2 TB of 3DS ECC RDIMM or LRDIMM across its 16 DIMM slots at DDR4-2666 speeds.

What does the dual 10GBase-T LAN cap at in real throughput?

The Intel X722 and X557 controllers provide two 10GBase-T ports, but the specification lists maximum LAN speed as 2 x 1 Gbps.

What chassis clearance does the E-ATX form factor and dual LGA 3647 sockets require?

Extended ATX dimensions with two LGA 3647 sockets need a full-height E-ATX server chassis that provides enough width for both CPU coolers and the 16 DIMM slots.

Arī šajā sadaļā

Klienti arī salīdzināja

Tas pats plaukts, tā pati kase — astoņas kriptovalūtas un kursa fiksēšana uz 30 minūtēm.