Supermicro MBD-X11DPI-N-B server motherboard, dual LGA 3647, C621, 16 DIMM slots, E-ATX
- Dual LGA 3647
- Supports 2nd Gen In…
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Supermicro
Dual-socket server board for 2nd Gen Intel Xeon Scalable CPUs with C622 chipset, 16 DDR4 DIMM slots up to 2 TB, 14 SATA ports, four PCIe 3.0 x16 and two x8 slots, plus dual 10GBase-T LAN
Option Dual LAN with 10GBase-T
The Supermicro MBD-X11DPI-NT-O is a dual-socket Extended ATX motherboard built for Intel Xeon Scalable processors in the LGA 3647 package. It targets builders assembling multi-socket servers that need large memory capacity and abundant storage connectivity in a single node. The board supports CPU TDPs up to 205 W and two UPI links at 10.4 GT/s for inter-socket bandwidth.
Memory capacity is the decisive spec: sixteen DIMM slots accept ECC RDIMM or LRDIMM at 2666, 2400 or 2133 MHz, reaching 2 TB when 3DS parts are populated. Standard RDIMMs without 3DS stacking will not reach the maximum stated capacity, so buyers planning the full 2 TB must source 3DS-rated modules.
The Extended ATX form factor requires a server case with matching mounting holes and sufficient clearance for the dual-socket keep-out zone. Fourteen SATA 6.0 Gb/s ports and two internal NVMe x4 connectors create dense cable routing; installers should verify backplane or drive-bay cabling reaches all headers before finalising the build.
| Brand | SUPERMICRO |
|---|---|
| Model | MBD-X11DPI-NT-O |
| CPU Socket Type | Dual LGA 3647 |
| CPU Type | Supports 2nd Gen Intel Xeon Scalable Processors and Intel Xeon Scalable Processors |
| North Bridge | Intel C622 |
| DDR4 Standard | 2666 / 2400 / 2133 MHz ECC DDR4 RDIMM, LRDIMM |
| Maximum Memory Supported | Up to 2TB 3DS ECC RDIMM, DDR4-2666 MHz; Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots |
| PCI Express 3.0 x16 | 4 |
| PCI Express x8 | 2 x PCI-E 3.0 x8 |
| SATA | 14 x SATA 6.0Gb/s |
| SATA RAID | 0/1/5/10 |
| Onboard Video Chipset | Aspeed AST2500 |
| Number of LAN | Dual LAN with 10GBase-T with Intel X722 + X557 |
| Max LAN Speed | 2 x 1Gbps |
| COM | 1 |
| S-Video | 1 x VGA port |
| USB 1.1/2.0 | 2 x USB 2.0 |
| USB 3.0 | 2 x USB 3.0 |
| Features | Intel Xeon Scalable Processors, Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s Intel C622 Up to 2TB 3DS ECC RDIMM, DDR4-2666 MHz; Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots 4 x PCI-E 3.0 x16, 2 x PCI-E 3.0 x8 M.2 Interface: PCI-E 3.0 x4 M.2 Form Factor: 2260, 2280, 22110 M.2 Key: M-Key, 2 x PCI-E 3.0 NVMe x4 Internal Port(s) 1 x VGA port Intel C622 controller for 14 SATA3 (6 Gbps) ports; RAID 0, 1, 5, 10 Dual LAN with 10GBase-T with Intel X722 + X557 |
| Form Factor | Extended ATX |
| Dimensions (W x L) | 12.0" x 13.0" |
| Sūtījuma svars | 2.04 kg |
| Sūtījuma izmēri | 429 × 338 × 89 mm |
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The board supports up to 2 TB of 3DS ECC RDIMM or LRDIMM across its 16 DIMM slots at DDR4-2666 speeds.
The Intel X722 and X557 controllers provide two 10GBase-T ports, but the specification lists maximum LAN speed as 2 x 1 Gbps.
Extended ATX dimensions with two LGA 3647 sockets need a full-height E-ATX server chassis that provides enough width for both CPU coolers and the 16 DIMM slots.
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