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Green E-ATX server motherboard with dual LGA 3647 sockets and sixteen DIMM slots

Supermicro

Supermicro MBD-X11DPI-NT-O dual Xeon LGA 3647 server motherboard

SKU CH-CYVT-4E1NT MPN MBD-X11DPI-NT-O

Dual-socket server board for 2nd Gen Intel Xeon Scalable CPUs with C622 chipset, 16 DDR4 DIMM slots up to 2 TB, 14 SATA ports, four PCIe 3.0 x16 and two x8 slots, plus dual 10GBase-T LAN

  • CPU Socket TypeDual LGA 3647
  • CPU TypeSupports 2nd Gen Intel Xeon Scalable Processors and Intel Xe
  • North BridgeIntel C622
  • DDR4 Standard2666 / 2400 / 2133 MHz ECC DDR4 RDIMM, LRDIMM
  • Maximum Memory SupportedUp to 2TB 3DS ECC RDIMM, DDR4-2666 MHz; Up to 2TB 3DS ECC LR
  • PCI Express 3.0 x164

Option Dual LAN with 10GBase-T

  • Dual LAN with 10GBase-T
  • Dual LAN with GbE

Durchgestrichene Varianten existieren, sind hier aber nicht vorrätig.

  • Dual Xeon Scalable support for high-density compute
  • 16 DDR4 slots enable up to 2TB ECC memory
  • 14 SATA 6Gb/s ports with RAID 0/1/5/10
  • Dual 10GBase-T LAN via Intel X722 and X557
  • 4 PCIe 3.0 x16 plus 2 x8 slots for expansion

Dual LGA 3647 server board for high-density compute

The Supermicro MBD-X11DPI-NT-O is a dual-socket Extended ATX motherboard built for Intel Xeon Scalable processors in the LGA 3647 package. It targets builders assembling multi-socket servers that need large memory capacity and abundant storage connectivity in a single node. The board supports CPU TDPs up to 205 W and two UPI links at 10.4 GT/s for inter-socket bandwidth.

Sixteen DDR4 slots scale to 2 TB with 3DS modules

Memory capacity is the decisive spec: sixteen DIMM slots accept ECC RDIMM or LRDIMM at 2666, 2400 or 2133 MHz, reaching 2 TB when 3DS parts are populated. Standard RDIMMs without 3DS stacking will not reach the maximum stated capacity, so buyers planning the full 2 TB must source 3DS-rated modules.

E-ATX layout demands a compatible chassis

The Extended ATX form factor requires a server case with matching mounting holes and sufficient clearance for the dual-socket keep-out zone. Fourteen SATA 6.0 Gb/s ports and two internal NVMe x4 connectors create dense cable routing; installers should verify backplane or drive-bay cabling reaches all headers before finalising the build.

Besonderheiten

  • Dual Xeon Scalable support for high-density compute
  • 16 DDR4 slots enable up to 2TB ECC memory
  • 14 SATA 6Gb/s ports with RAID 0/1/5/10
  • Dual 10GBase-T LAN via Intel X722 and X557
  • 4 PCIe 3.0 x16 plus 2 x8 slots for expansion

Technische Daten

BrandSUPERMICRO
ModelMBD-X11DPI-NT-O
CPU Socket TypeDual LGA 3647
CPU TypeSupports 2nd Gen Intel Xeon Scalable Processors and Intel Xeon Scalable Processors
North BridgeIntel C622
DDR4 Standard2666 / 2400 / 2133 MHz ECC DDR4 RDIMM, LRDIMM
Maximum Memory SupportedUp to 2TB 3DS ECC RDIMM, DDR4-2666 MHz; Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
PCI Express 3.0 x164
PCI Express x82 x PCI-E 3.0 x8
SATA14 x SATA 6.0Gb/s
SATA RAID0/1/5/10
Onboard Video ChipsetAspeed AST2500
Number of LANDual LAN with 10GBase-T with Intel X722 + X557
Max LAN Speed2 x 1Gbps
COM1
S-Video1 x VGA port
USB 1.1/2.02 x USB 2.0
USB 3.02 x USB 3.0
FeaturesIntel Xeon Scalable Processors, Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel C622
Up to 2TB 3DS ECC RDIMM, DDR4-2666 MHz; Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
4 x PCI-E 3.0 x16, 2 x PCI-E 3.0 x8
M.2 Interface: PCI-E 3.0 x4
M.2 Form Factor: 2260, 2280, 22110
M.2 Key: M-Key,
2 x PCI-E 3.0 NVMe x4 Internal Port(s)
1 x VGA port
Intel C622 controller for 14 SATA3 (6 Gbps) ports; RAID 0, 1, 5, 10
Dual LAN with 10GBase-T with Intel X722 + X557
Form FactorExtended ATX
Dimensions (W x L)12.0" x 13.0"
Versandgewicht2.04 kg
Paketgröße429 × 338 × 89 mm

Fragen zu diesem Artikel

How much memory can the board actually address once populated with 3DS modules?

The board supports up to 2 TB of 3DS ECC RDIMM or LRDIMM across its 16 DIMM slots at DDR4-2666 speeds.

What does the dual 10GBase-T LAN cap at in real throughput?

The Intel X722 and X557 controllers provide two 10GBase-T ports, but the specification lists maximum LAN speed as 2 x 1 Gbps.

What chassis clearance does the E-ATX form factor and dual LGA 3647 sockets require?

Extended ATX dimensions with two LGA 3647 sockets need a full-height E-ATX server chassis that provides enough width for both CPU coolers and the 16 DIMM slots.

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