Thermal Grizzly
Thermal Grizzly Minus Pad High Compression 120x100x3.0mm 2-Pack thermal pad
High-compression thermal pad kit with two 120x100x3.0mm sheets that maintain conductivity under pressure for GPU and SSD cooling
- FeaturesThe thermal pads of the Minus Pad High Compression series of
- Excellent thermal conductivity maintained under heavy compression
- Very high compressibility bridges varying height differences simultaneously
- Electrically non-conductive design ensures safe application on sensitive components
- Versatile pad suits VRAM, voltage regulators and other contact surfaces
- Easy handling simplifies installation on GPUs and SSDs
High-compression thermal pads 120x100mm
Thermal Grizzly Minus Pad High Compression pads measure 120 by 100 millimetres and are 3.0 millimetres thick. The two-pack delivers very high compressibility so a single pad can bridge varying height differences on a graphics card or SSD. They are electrically non-conductive and maintain or improve thermal conductivity under heavy pressure.
Suits GPU water-cooling conversions
Builders converting a graphics card to a water block or replacing cooler pads on VRAM and voltage regulators benefit from the pad's tolerance to height differences. Users who need a specific thin profile or a pre-cut shape for a particular laptop should look at something else.
3.0 mm thickness defines compression range
The 3.0 millimetre starting thickness determines how much the pad can compress while keeping contact across uneven surfaces. Choose this spec when the exact gap is unknown and a thicker, highly compressible pad is required.
Priekšrocības
- Excellent thermal conductivity maintained under heavy compression
- Very high compressibility bridges varying height differences simultaneously
- Electrically non-conductive design ensures safe application on sensitive components
- Versatile pad suits VRAM, voltage regulators and other contact surfaces
- Easy handling simplifies installation on GPUs and SSDs
Specifikācijas
| Brand | Thermal Grizzly |
|---|---|
| Model | TG-MP-HC-120-100-30-2 |
| Part Number | TG-MP-HC-120-100-30-2 |
| Features | The thermal pads of the Minus Pad High Compression series offer extremely high compressibility combined with excellent thermal conductivity. They are especially practical when converting a graphics card to a water cooler, as a single pad thickness can be used across various contact points. |
Jautājumi par šo preci
What component spacing can the 3.0 mm Minus Pad High Compression accommodate when converting a graphics card to a water cooler?
The 3.0 mm pad compresses heavily, so a single pad can bridge different height gaps across VRAM, voltage regulators and the GPU die at the same time.
Will the pad remain electrically safe if it contacts exposed PCB traces on an older graphics card?
Yes, the material is electrically non-conductive, so it will not cause shorts even when pressed against bare circuitry on legacy boards.
How can I verify the pad is performing correctly after installing it on my GPU?
Monitor VRAM and VRM temperatures under load; they should stay lower and more even than with the original pads, confirming good contact and conductivity.
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