AMD EPYC 7302 100-100000043WOF 16-core 3.0 GHz server processor
- EPYC 7302
- Socket SP3
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AMD
A 64-core server processor with 128 threads, 256 MB L3 cache, eight-channel DDR4-3200 support and 128 lanes of PCIe 4.0
The AMD EPYC 7742 is a 64-core, 128-thread server processor built on the 7 nm Rome architecture for Socket SP3 platforms. It runs at a 2.25 GHz base frequency and can boost to 3.4 GHz across its 256 MB L3 cache. The chip supports eight channels of DDR4 3200 memory and exposes 128 lanes of PCI Express 4.0 with a 225 W TDP.
This processor targets virtualisation hosts, high-performance computing clusters and database servers that benefit from maximum core density in a single socket. It is not intended for desktop builds, workstations that require integrated graphics, or systems limited to single-threaded application performance. Buyers needing a lower core count or reduced power envelope should evaluate other SKUs.
The 128 PCI Express 4.0 lanes define the I/O ceiling for storage controllers, GPU accelerators and high-speed network adapters in one- or two-socket configurations. This lane count determines how many peripherals can operate at full interface bandwidth without sharing. Verify your motherboard and chassis backplane can route the required lanes before purchase.
| Brand | AMD |
|---|---|
| Series | AMD EPYC 7002 |
| Name | EPYC 7742 |
| Model | 100-100000053WOF |
| CPU Socket Type | Socket SP3 |
| # of Cores | 64-Core |
| # of Threads | 128 |
| Operating Frequency | 2.25 GHz |
| Max Turbo Frequency | 3.4 GHz |
| L3 Cache | 256MB |
| 64-Bit Support | Yes |
| Integrated Memory Controller Speed | DDR4 3200 |
| Memory Channel | 8 Channel |
| PCI Express Revision | 4.0 |
| Max # of PCI Express Lanes | 128 |
| Thermal Design Power | 225W |
| Cooling Device | Cooling device not included - Processor Only |
| Berat penghantaran | 0.45 kg |
| Dimensi bungkusan | 203 × 127 × 51 mm |
Versi lain model ini
Keluarga yang sama, memori, penyejuk atau kelajuan jam yang berbeza — bandingkan sebelum membuat keputusan.
Align the gold triangle on the processor with the socket triangle, lower it vertically without force, then secure the carrier using the specified torque sequence; the step most often missed is tightening the captive screws in the correct diagonal order.
Plan to replace the thermal interface material every two to three years and clean the heatsink fins regularly; the processor itself has no user-serviceable parts and the cooling device is not included.
When all 64 cores run continuously at 2.25 GHz the 225W thermal envelope is reached, so the cooling solution must dissipate that power indefinitely or the processor will throttle to stay within its rated TDP.
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