EN-Labs 11-001-366 PCIe x4 USB 3.2 10Gbps 5-port card
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Kami menerima kripto — jadi koin yang anda simpan boleh membeli perkakasan sebenar.Bayar dengan kripto, belanjakannya untuk perkakasan sebenar. Penghantaran berinsurans percuma ke seluruh dunia untuk belian melebihi USD 399. Kotak biasa tanpa jenama, dihantar dari Jerman.Penghantaran berinsurans percuma untuk belian melebihi USD 399. Kadar anda dikunci selama 30 minit sebaik sahaja proses pesanan bermula.Kadar dikunci selama 30 minit. Setiap item disegel, nombor sirinya disemak, dan dilindungi waranti 24 bulan.Disegel, waranti 24 bulan.
AMD
Eight-core server CPU with 3.7 GHz base, 3.9 GHz boost, 128 MB L3 cache and 128 PCIe 4.0 lanes for high-frequency workloads
The AMD EPYC 7F32 is an eight-core, sixteen-thread CPU built for Socket SP3 platforms. It runs at a 3.7 GHz base frequency and can reach 3.9 GHz max turbo. The 128 MB L3 cache and eight-channel DDR4-3200 memory controller suit workloads that demand high single-thread speed and large memory bandwidth.
Rated at 180 W TDP, the processor dissipates significant heat under sustained load and requires robust server-grade cooling. The 7 nm manufacturing process helps efficiency, but power draw will approach the rated figure during all-core turbo operation. Acoustic output depends entirely on the chosen heatsink and system fan curves.
This part replaces lower-frequency EPYC 7002 models when per-core performance matters more than core count. The jump is worth it for latency-sensitive databases, high-frequency trading or single-threaded HPC codes that benefit from the 3.7 GHz base clock. It is not for buyers who need higher core counts or greater thread density.
| Brand | AMD |
|---|---|
| Series | AMD EPYC 7002 |
| Name | EPYC 7F32 |
| Model | 100-000000139 |
| CPU Socket Type | Socket SP3 |
| # of Cores | 8-Core |
| # of Threads | 16 |
| Operating Frequency | 3.7 GHz |
| Max Turbo Frequency | 3.9 GHz |
| L3 Cache | 128MB |
| 64-Bit Support | Yes |
| Manufacturing Tech | 7 nm |
| Integrated Memory Controller Speed | DDR4 3200 |
| Memory Channel | 8 Channel |
| Virtualization Technology Support | Yes |
| PCI Express Revision | 4.0 |
| Max # of PCI Express Lanes | 128 |
| Thermal Design Power | 180W |
| Berat penghantaran | 0.82 kg |
| Dimensi bungkusan | 152 × 152 × 102 mm |
Align the triangle marker on the processor with the socket key, lower it gently without force, then close the retention frame fully; the step many miss is torquing the heatsink mounting screws in a diagonal pattern to the specified pressure so the 180 W TDP makes even contact.
The processor itself has no user-serviceable parts; plan to replace thermal paste every two to three years and verify the cooler’s fan curve keeps the 180 W TDP within safe temperatures under sustained load.
The 180 W thermal design power is the first ceiling; if cooling cannot dissipate that heat continuously, the 3.7 GHz base clock will throttle before the 3.9 GHz max turbo or the 128 PCIe 4.0 lanes become bottlenecks.
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